Semiconductor nanoparticle assembly and method for manufacturing the same
AssigneeKonica Minolta, Inc.
InventorsKazuyoshi Goan, Hidekazu Kawasaki, Yoichi Fujieda
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Abstract
The present invention provides a semiconductor nanoparticle assembly having improved luminous efficiency, heat resistance, and oxidation resistance, and a method for manufacturing the same. The present invention relates to a semiconductor nanoparticle assembly which includes an aggregate having a plurality of coated semiconductor nanoparticles aggregated, said coated semiconductor nanoparticles each containing a semiconductor nanoparticle having a core/shell structure and a translucent coating layer having a thickness of 3 nm or more and 15 nm or less for coating the semiconductor nanoparticle.
Claims12
A semiconductor nanoparticle assembly which includes an aggregate having a plurality of coated semiconductor nanoparticles aggregated, said coated semiconductor nanoparticles each containing a semiconductor nanoparticle having a core/shell structure and a translucent coating layer having a thickness of 3 nm or more and 15 nm or less for coating the semiconductor nanoparticle.
A method for manufacturing a semiconductor nanoparticle assembly, comprising:
- coating a semiconductor nanoparticle having a core/shell structure with a translucent coating layer having a thickness of 3 nm or more and 15 nm or less to manufacture a coated semiconductor nanoparticle;
- and
- aggregating a plurality of the coated semiconductor nanoparticles to manufacture an aggregate.
Dependencies are inferred from the claim text.