Thermosetting resin composition and uses thereof
AssigneeShengyi Technology Co., Ltd.
InventorsCuiming Du, Liangpeng Hao, Songgang Chai
Life of this patent
Estimating the term…
Abstract
A thermosetting resin composition comprising a thermosetting resin, an inorganic filler, and an organomolybdenum compound is disclosed. The thermosetting resin composition may be used for preparing a resin vanish and a prepreg, wherein the prepreg is used for laminates and printed circuit boards.
Claims17
A thermosetting resin composition wherein the thermosetting resin composition comprises a thermosetting resin, an inorganic filler, and an organomolybdenum compound;
- wherein thermosetting resin composition further comprises organosilicone powder;
- wherein the organosilicone powder comprises about 0.1 to about 30 wt. %, of the total mass of the thermosetting resin composition;
- and
- wherein the organomolybdenum compound comprises about 0.01 to about 20 wt. % of the total mass of the thermosetting resin composition.
The thermosetting resin composition as claimed in claim wherein the organomolybdenum compound is selected from the group consisting of oxymolybdenum dialkyldithiophosphate, molybdenum dialkyldithiocarbamate, molybdenum amine complex, molybdenum naphthenate, molybdenum alkylalicylate, dithiolan molybdenum, dimercapto thiazole molybdenum, alkylamine molybdenum, organic molybdate and molybdenum caprylate, or a combination of at least two or more thereof.
Dependencies are inferred from the claim text.