Photosensitive resin composition and adhesives composition

A photosensitive resin composition comprising a polymer having a repeating structural unit of the following Formula (1):

• (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a compound of the following Formula (4):
• (wherein A is a divalent alicyclic hydrocarbon group, R3 and R4 are each independently a single bond, a methylene group, or an ethylene group, and R5 and R6 are each independently a hydrogen atom or a methyl group), a compound of the following Formula (5):
• (wherein R7 is a methylene group, an ethylene group, a propylene group, or a trimethylene group, m is an integer of 2 to 4, and Z is a C4-9 organic group), a photo-radical generator, and an organic solvent, wherein the compound of Formula (4) is contained in an amount of 5% by mass to 50% by mass, and the compound of Formula (5) is contained in an amount of 0.1% by mass to 10% by mass, relative to the content of the polymer.