Flexible wiring board and use thereof
AssigneeNoritake Co., Limited
InventorsShuhei Fukaya, Hirohito Kakizoe, Tatsuya Baba, Terusada Sugiura, Yasushi Yoshino
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Abstract
Provided is a flexible wiring board having high durability. The present invention provides a flexible wiring board including a flexible substrate and a conductive film formed on the flexible substrate. The conductive film contains a conductive powder and a curd product of a heat curable resin. The conductive film has pencil hardness of at least 2H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999). The conductive film has adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990).
Claims17
A flexible wiring board comprising:
- a flexible substrate;
- and a conductive film formed on the flexible substrate, wherein
- the conductive film contains a conductive powder and a cured product of a heat curable resin and has following characteristics:
- (1) pencil hardness of at least 3H, based on a pencil scratch hardness test in accordance with JIS K5600 5-4 (1999);
- (2) adhesiveness of at least 95/100 by a 100 squares cross-cut test in accordance with JIS K5400 (1990);
- and
- the heat curable resin comprises (a) an epoxy resin.
Dependencies are inferred from the claim text.