Epoxy resin composition, prepreg and laminate using same
AssigneeShengyi Technology Co., Ltd.
InventorsXianping Zeng, Liexiang He, Yongjing Xu
Life of this patent
Estimating the term…
Abstract
Provided in the present invention are an epoxy resin composition, prepreg and laminate using the same, the epoxy resin composition comprising the following components: (A) an imide modified epoxy resin; and (B) a crosslinking agent, the imide modified epoxy resin being an epoxy resin having a structure of formula (1) and/or formula (2). The prepreg and laminate prepared from the epoxy resin composition have a high glass-transition temperature, a low dielectric constant, a low dielectric loss factor, a high heat and humidity resistance, a high toughness and a good processability.
Claims22
An epoxy resin composition, characterized in comprising
- (A) imide-modified epoxy resin;
- (B) crosslinking agent;
- wherein the imide-modified epoxy resin is an epoxy resin having formula (1) and/or (2),
- A in Formulae (1) and (2) is independently unsubstituted phenyl or C1-C4 alkyl-substituted phenyl;
- n1, n2 and n3 all are independently integers which is greater than or equals to 1;
- R in Formulae (1) and (2) is independently
- in Formula (1), R′ is
- wherein R″ is a single bond,
Dependencies are inferred from the claim text.