Metal coating on ceramic substrates
AssigneeCeramTec GmbH
InventorsKlaus Herrmann, Roland Leneis, Alfred Thimm, Alexander Dohn
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Abstract
A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.
Claims16
A method for producing an electrically conducting metal coating on ceramic substrates, wherein the metal coating is in direct contact with the ceramic substrate and is solderable and/or weldable, the method comprising the steps of:
- a) producing a metal-coating paste comprising at least one metal selected from the group consisting of a conducting metal, a solderable metal and weldable metal;
- b) applying the metal-coating paste to the ceramic substrate;
- c) baking-on of the metal-coating paste;
- wherein the metal coating does not contain a noble metal selected from the group consisting of platinum, gold, palladium and silver, wherein the metal-coating paste further comprises at least one additive, wherein the additive comprises an element of the transition groups IVB, VB and VIB of the periodic table.
A method for producing an electrically conducting metal coating on ceramic substrates, wherein the metal coating is in direct contact with the ceramic substrate and is solderable and/or weldable, the method comprising the steps of:
- a) producing a metal-coating paste comprising at least one metal selected from the group consisting of a conducting metal, a solderable metal and weldable metal;
- b) applying the metal-coating paste to the ceramic substrate;
- c) baking-on of the metal-coating paste;
- wherein the metal coating does not contain a noble metal selected from the group consisting of platinum, gold, palladium and silver, wherein the metal-coating paste further comprises at least one additive, wherein the additive comprises at least one member selected from the group consisting of Ti, Zr, W and Al, or compounds thereof.
A method for producing an electrically conducting metal coating on ceramic substrates, wherein the metal coating is in direct contact with the ceramic substrate and is solderable and/or weldable, the method comprising the steps of:
- a) producing a metal-coating paste comprising at least one metal selected from the group consisting of a conducting metal, a solderable metal and weldable metal;
- b) applying the metal-coating paste to the ceramic substrate;
- c) baking-on of the metal-coating paste;
- wherein the metal coating does not contain a noble metal selected from the group consisting of platinum, gold, palladium and silver, wherein the metal-coating paste further comprises at least one additive, wherein the metal-coating paste further comprises a glass.
A method for producing an electrically conducting metal coating on ceramic substrates, wherein the metal coating is in direct contact with the ceramic substrate and is solderable and/or weldable, the method comprising the steps of:
- a) producing a metal-coating paste comprising at least one metal selected from the group consisting of a conducting metal, a solderable metal and weldable metal;
- b) applying the metal-coating paste to the ceramic substrate;
- c) baking-on of the metal-coating paste;
- wherein the metal coating does not contain a noble metal selected from the group consisting of platinum, gold, palladium and silver,
- wherein the metal-coating paste further comprises an oxidic glass.
Dependencies are inferred from the claim text.