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US 10,207,500 B2Granted
Print head interposers
AssigneeHewlett-Packard Development Company, L.P.
InventorsMichael W. Cumbie, Devin Alexander Mourey, Chien-Hua Chen
Life of this patent
Estimating the term…
Abstract
In example implementations, an apparatus with an interposer is provided. The apparatus may include an epoxy molded compound (EMC). A print head die and a drive integrated circuit (IC) may be embedded in the EMC. An interposer may also be embedded in the EMC. The print head die, the drive IC and the interposer may be wire bonded within the EMC.
Claims15
An apparatus, comprising:
- an epoxy molded compound (EMC);
- a print head die embedded in the EMC;
- a drive integrated circuit (IC) embedded in the EMC;
- and
- an interposer embedded in the EMC, wherein the print head die, the drive IC and the interposer are wire bonded within the EMC.
2 more elements
A method, comprising:
- providing a carrier;
- applying a thermal release tape over the carrier;
- attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape;
- encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC);
- and
- removing the carrier and the thermal release tape.
3 more elements
A method, comprising:
- preparing an interposer, wherein the interposer includes an application specific integrated circuit (ASIC);
- attaching the interposer and a print head die to a thermal release tape that is on a carrier;
- connecting the print head die to the interposer via at least one electrical connection;
- encapsulating the print head die, the interposer and the at least one electrical connection via an epoxy molded compound (EMC);
- removing the thermal release tape and the carrier;
- forming a slot over an area in the EMC that covers ink feed holes in the print head die;
- and
- removing a protective top hat on the print head die.
5 more elements
Dependencies are inferred from the claim text.