Liquid jetting apparatus and wiring member
AssigneeBrother Kogyo Kabushiki Kaisha
InventorToru Yamashita
Life of this patent
Estimating the term…
Abstract
A liquid jetting apparatus includes: a head unit including a first driving element, a second driving element, a first contact portion connected to the first driving element, and a second contact portion connected to the second driving element; and a wiring member including a flexible substrate, a first driving IC provided on the flexible substrate, a second driving IC provided on the flexible substrate, a first wire formed in the flexible substrate and connecting the first driving IC and the first contact portion, and a second wire formed in the flexible substrate and connecting the second driving IC and the second contact portion. A conductive part different from the first wire and the second wire is disposed in an area of the flexible substrate between the first driving IC and the second driving IC.
Claims20
A liquid jetting apparatus, comprising:
- a head unit including a first driving element, a second driving element, a first contact portion connected to the first driving element, and a second contact portion connected to the second driving element;
- and
- a wiring member including a flexible substrate, a first driving IC provided on the flexible substrate, a second driving IC provided on the flexible substrate, a first wire formed in the flexible substrate and connecting the first driving IC and the first contact portion, and a second wire formed in the flexible substrate and connecting the second driving IC and the second contact portion,
- wherein a conductive part different from the first wire and the second wire is disposed in an area of the flexible substrate between the first driving IC and the second driving IC.
A wiring member connected to a head unit including a first contact portion and a second contact portion, the wiring member comprising:
- a flexible substrate;
- a first driving IC and a second driving IC provided on the flexible substrate;
- a first wire formed in the flexible substrate and connecting the first driving IC and the first contact portion of the head unit;
- a second wire formed in the flexible substrate and connecting the second driving IC and the second contact portion of the head unit;
- and
- a conductive part different from the first wire and the second wire and formed in an area between the first driving IC and the second driving IC.
A liquid jetting apparatus, comprising:
- a head unit including a first piezoelectric element, a second piezoelectric element, a first contact portion connected to the first piezoelectric element, and a second contact portion connected to the second piezoelectric element, the first and second piezoelectric elements and the first and second contact portions being arranged in a predefined direction, the first and second piezoelectric elements being positioned between the first and second contact portions in the predefined direction, the first piezoelectric element being positioned between the first contact portion and the second piezoelectric element, the second piezoelectric element being positioned between the second contact portion and the first piezoelectric element;
- and
- a wiring member including a first part connected to the first contact portion of the head unit, a second part connected to the second contact portion of the head unit, and a connection part connecting the first part and the second part, the first and second parts being arranged in the predefined direction, the connection part being positioned between the first and second parts in the predefined direction,
- wherein at least a portion of the connection part has higher rigidity than the first and second parts of the wiring member.
Dependencies are inferred from the claim text.