Heat-conducting foam sheet for electronic devices

A thermally conductive foam sheet for electronic equipment, comprising:

• a silicone resin (A);
• and thermal conductor particles (B) and bubbles dispersed in the silicone resin (A), wherein
• a content of the thermal conductor particles (B) is 100 to 400 parts by mass based on 100 parts by mass of the silicone resin (A),
• the thermal conductor particles (B) have an average particle diameter of 50 μm or less and a thermal conductivity of 8 W/m·K or more, and
• the thermally conductive foam sheet has a 25% compressive strength of 200 kPa or less and a thickness of 0.8 mm or less.