Method for bonding components by using energy ray-curable adhesive

A method for bonding a first component containing a material incapable of transmitting an energy ray in a first wavelength range to a second component in fabricating an assembly comprising the first component and the second component, wherein the assembly comprises an optical encoder and the first component comprises a slit plate used for the optical encoder,

• the method comprising:
• applying, to one component of the first component and the second component,
• a wavelength conversion element that converts an energy ray in a second wavelength range capable of being transmitted through the first component into an energy ray in the first wavelength range and that emits the energy ray in the first wavelength range, and
• an energy ray-curable adhesive curable by irradiation with the energy ray in the first wavelength range, the energy ray-curable adhesive being applied on the wavelength conversion element;
• bringing the other component of the first component and the second component into contact with the energy ray curable adhesive;
• and
• transmitting the energy ray in the second wavelength range through the first component to the energy ray-curable adhesive and the wavelength conversion element, thus curing the energy ray-curable adhesive.