Nickel particle composition, bonding material, and bonding method in which said material is used
AssigneeNippon Steel Chemical & Material Co., Ltd.
InventorTakayuki Shimizu
Life of this patent
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Abstract
A nickel particle composition is shown, including: A) a nickel particle having an average particle size in the range of 0.5 μm to 20 μm obtained via a laser diffraction/scattering method and containing 50 wt % or more of a nickel element; B) a nickel fine particle having an average primary particle size in the range of 30 nm to 200 nm observed via a scanning electron microscope and containing 50 wt % or more of a nickel element; and C) an organic binder in the range of 0.1 wt % to 2.5 wt % relative to the total metal content; and the weight ratio of a component A to a component B (component A:component B) is in the range of 30:70 to 70:30.
Claims9
A nickel particle composition, comprising the following component A to component C:
- component A:
- a nickel particle having an average particle size in a range of 0.5 μm to 20 μm obtained via a laser diffraction/scattering method and containing 50 wt % or more of a nickel element;
- component B:
- a nickel fine particle having an average primary particle size in a range of 30 nm to 200 nm observed via a scanning electron microscope and containing 50 wt % or more of the nickel element;
- and
- component C:
- an organic binder in a range of 0.1 wt % to 2.5 wt % relative to a total metal content;
- and
- a weight ratio of the component A to the component B (component A:component B) is in a range of 30:70 to 70:30.
Dependencies are inferred from the claim text.