Laser reseal including optimized intensity distribution

A method for manufacturing a micromechanical component including a substrate and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the method comprising:

• in a first method step, forming, in the substrate or the cap, an access opening connecting the first cavity to surroundings of the micromechanical component;
• in a second method step, adjusting, in the first cavity, at least one of the first pressure and the first chemical composition;
• in a third method step, sealing the access opening by introducing energy or heat into an absorbing part of the substrate or the cap, with the aid of a laser, wherein the introduction of the energy or heat is controlled with the aid of a laser beam, which includes a spatial laser pulse expansion extending along a surface of the substrate or the cap facing away from the first cavity and extending in parallel to a main extension plane of the substrate, and a laser pulse intensity to minimize internal stresses in the substrate or in the cap.