Metallic microneedles
AssigneeMicrodermics Inc.
InventorsBoris Stoeber, Iman Mansoor, Urs Otto Häfeli
Life of this patent
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Abstract
Methods for fabricating metallic microneedles are disclosed. One method comprises providing a mold pillar; forming an apertured electrically-conductive layer over the mold pillar; and depositing a metal layer over the electrically-conductive layer to provide an apertured microneedle. Another method comprises providing a mold pillar; depositing a first metal layer over the mold pillar to provide a first microneedle; removing the first microneedle from the mold pillar; and depositing a second metal layer over the mold pillar to provide a second microneedle.
Claims14
A method for fabricating a first microneedle and a second microneedle, the method comprising:
- providing a mold pillar;
- forming an electrically-conductive layer over the mold pillar by:
- applying a solution onto the mold pillar, the solution comprising a polymer and conductive particles dissolved in a solvent;
- and
- evaporating the solvent from the mold pillar to leave behind the electrically-conductive layer on the mold pillar;
- depositing a first metal layer over the electrically-conductive layer to provide a first microneedle;
- removing the first microneedle from the mold pillar;
- and
- depositing a second metal layer over the mold pillar to provide a second microneedle;
- wherein depositing the first metal layer over the electrically-conductive layer comprises using the electrically-conductive layer as an electrode and electroplating the first metal layer onto the electrically-conductive layer.
A method for fabricating a first microneedle and a second microneedle, the method comprising:
- providing a mold pillar;
- forming an electrically-conductive layer over the mold pillar by:
- applying a solution onto the mold pillar, the solution comprising a polymer and conductive particles dissolved in a solvent;
- and
- evaporating the solvent from the mold pillar to leave behind the electrically-conductive layer on the mold pillar;
- depositing a first metal layer over the electrically-conductive layer to provide a first microneedle;
- removing the first microneedle from the mold pillar;
- and
- depositing a second metal layer over the mold pillar to provide a second microneedle;
- wherein the electrically-conductive layer comprises an apertured electrically-conductive layer;
- and
- forming the apertured electrically-conductive layer by:
- applying a coating to a region of the mold pillar before forming the electrically-conductive layer over the mold pillar;
- and
- choosing the solvent such that the solvent is repelled by the coating so that the electrically-conductive layer is created with an aperture located at the coated region.
A method for fabricating a first microneedle and a second microneedle, the method comprising:
- providing a mold pillar;
- forming an electrically-conductive layer over the mold pillar by:
- applying a solution onto the mold pillar, the solution comprising a polymer and conductive particles dissolved in a solvent;
- and
- evaporating the solvent from the mold pillar to leave behind the electrically-conductive layer on the mold pillar;
- depositing a first metal layer over the electrically-conductive layer to provide a first microneedle;
- removing the first microneedle from the mold pillar;
- and
- depositing a second metal layer over the mold pillar to provide a second microneedle;
- wherein the electrically-conductive layer comprises an apertured electrically-conductive layer;
- and
- forming the apertured electrically-conductive layer by:
- orienting the mold pillar so that a first region of the mold pillar is vertically higher than a second region of the mold pillar such that the force of gravity causes the electrically-conductive layer to form with an aperture at the first region.
Dependencies are inferred from the claim text.