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US 10,204,807 B2Granted
Apparatus and method for processing wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsYou-Hua Chou, Min-Hao Hong, Kuan-Chung Chen
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Abstract
An apparatus for processing a wafer includes a process chamber, a wafer support, a heat source, and a movable device. The wafer support is in the process chamber. The heat source is in the process chamber. The movable device contacts the heat source, in which the movable device is movable with respect to the wafer support.
Claims20
An apparatus for processing a wafer, comprising:
- a process chamber;
- a wafer support in the process chamber;
- a heat source in the process chamber and comprising a lamp socket configured to be coupled to a lamp;
- and
- a movable device comprising:
- a stator that is stationary with respect to the wafer support;
- and
- a lift pin that is movable with respect to the stator and that abuts the lamp socket.
5 more elements
An apparatus for processing a wafer, comprising:
- a process chamber;
- a wafer support in the process chamber;
- a heat source in the process chamber;
- and
- a movable device comprising a step motor having an output rod, wherein the heat source is coupled to the output rod so as to be co-movable therewith.
2 more elements
A method for processing a wafer, comprising:
- delivering the wafer into a process chamber;
- applying thermal energy to the wafer by a heat source;
- and
- moving a lift pin with a stator to move the heat source with respect to the wafer.
1 more element
Dependencies are inferred from the claim text.