Pressure sensitive adhesive composition, pressure sensitive adhesive film, and method of manufacturing organic electronic device using the same

An encapsulated organic electronic device, comprising:

• a substrate;
• an organic electronic element formed on the substrate;
• and
• a crosslinked pressure-sensitive adhesive film encapsulating the organic electronic element,
• wherein the pressure-sensitive adhesive film comprises a pressure-sensitive adhesive layer including a pressure-sensitive adhesive composition,
• wherein the pressure-sensitive adhesive composition comprises:
• an encapsulating resin comprising a copolymer of a diene and an olefin-based compound having one carbon-carbon double bond;
• a tackifier;
• and
• a multifunctional active energy ray-polymerizable compound satisfying Formula 1 which is included at 5 to 18 parts by weight relative to 100 parts by weight of the encapsulating resin,
• wherein the encapsulating resin has a glass transition temperature of less than 0° C., and
• wherein the pressure-sensitive adhesive composition has been crosslinked and has a gel content represented by Equation 1 of 50% or more,
• wherein R1 is hydrogen or an alkyl group having 1 to 4 carbon atoms, n is an integer of 2 or more, and X is a residue induced from a linear, branched, or cyclic alkyl group having 3 to 30 carbon atoms,
• Gel content (%)=B/A×100 [Equation 1]
• wherein A is a mass of the pressure-sensitive adhesive composition, and B is a dry mass of an insoluble content of the pressure-sensitive adhesive composition remaining after being dipped in toluene at 60° C. for 24 hours and filtered through a 200-mesh filter (pore size of 200 μm).