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US 10,200,013 B2Granted
Micro-transfer-printed acoustic wave filter device
AssigneeX-Celeprint Limited
InventorsChristopher Bower, Matthew Meitl, Ronald S. Cok
Life of this patent
Estimating the term…
Abstract
A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
Claims19
A compound acoustic wave filter device, comprising:
- a support substrate comprising two or more circuit connection pads;
- an acoustic wave filter comprising a piezoelectric filter element and two or more electrodes disposed on the piezoelectric filter element;
- an adhesive layer located between the support substrate and the acoustic wave filter, wherein the acoustic wave filter is micro-transfer printed on the adhesive layer and the adhesive layer adheres the support substrate to the acoustic wave filter;
- and
- two or more electrical conductors, each electrical conductor electrically connecting one of the two or more electrodes to one of the two or more circuit connection pads,
- wherein the acoustic wave filter or the piezoelectric filter element comprises at least a portion of a tether.
3 more elements
A method of making a compound acoustic wave filter device, comprising:
- providing a support substrate comprising two or more circuit connection pads;
- providing an acoustic wave filter, the acoustic wave filter comprising a piezoelectric filter element and two or more electrodes disposed in or on the piezoelectric filter element;
- providing an adhesive layer located on the support substrate;
- micro-transfer printing the acoustic wave filter onto the adhesive layer such that the adhesive layer is disposed between the support substrate and the acoustic wave filter;
- adhering the support substrate to the acoustic wave filter;
- and
- electrically connecting each of the two or more electrodes to one or more of the two or more circuit connection pads with electrical conductors.
4 more elements
A compound acoustic wave filter device, comprising:
- a support substrate comprising two or more circuit connection pads;
- an acoustic wave filter comprising a piezoelectric filter element and two or more electrodes disposed on the piezoelectric filter element;
- an adhesive layer located between the support substrate and the acoustic wave filter, wherein the acoustic wave filter is micro-transfer printed on the adhesive layer and the adhesive layer adheres the support substrate to the acoustic wave filter;
- two or more electrical conductors, each electrical conductor electrically connecting one of the two or more electrodes to one of the two or more circuit connection pads;
- and an active electronic circuit formed in or on the support substrate, the active electronic circuit electrically connected to one or more of the two or more circuit connection pads, wherein the support substrate is a semiconductor substrate.
2 more elements
A compound acoustic wave filter device, comprising:
- a support substrate comprising two or more circuit connection pads;
- an acoustic wave filter comprising a piezoelectric filter element and two or more electrodes disposed on the piezoelectric filter element;
- an adhesive layer located between the support substrate and the acoustic wave filter, wherein the acoustic wave filter is micro-transfer printed on the adhesive layer and the adhesive layer adheres the support substrate to the acoustic wave filter;
- and
- two or more electrical conductors, each electrical conductor electrically connecting one of the electrodes to one of the two or more circuit connection pads,
- wherein the electrical conductors are electrically conductive protrusions or spikes extending from the acoustic wave filter, a portion or layer of the acoustic wave filter, or the piezoelectric filter element, and
- wherein the electrically conductive protrusions or spikes are pressed into or through the two or more circuit connection pads.
4 more elements
Dependencies are inferred from the claim text.