Method for manufacturing in series optical grade polishing tools

A method for manufacturing in series optical grade polishing tools (10) each including a base (11) configured to be coupled to a polishing machine, a polishing pad (13) configured to be pressed against a surface to be worked and an elastically compressible body (12) attached to the base (11) and attached to polishing pad (13) with said body (12) sandwiched between the base (11) and the polishing pad (13);

• said method including for each said tool (10) the step of attaching said body (12) to said base (11) and the step of attaching said body (12) to said polishing pad (13);
• wherein at least one of said step of attaching said body (12) to said base (11) and said step of attaching said body (12) to said polishing pad (13) includes a step of applying glue in which glue is applied onto one surface of one component and then includes a step of pressing in which said one surface of one component and one surface of another component are applied on each other, said one component and said another component being one of:
• said base (11) and said body (12), said body (12) and said base (11), said body (12) and said polishing pad (13), and said polishing pad (13) and said body (12);
• said method further including:
• the step of providing a supporting device (20) including a support (23A-23D, 22A-22D) configured for receiving said one component and another support (23A-23D, 22A-22D) configured for receiving said another component;
• the step of providing a pad printing machine (35) having a reservoir (36), a cliché (37), a transfer pad (38A, 39A, 38B, 39B) and another transfer pad (38A, 39A, 38B, 39B);
• the step of filling said reservoir (36) with liquid glue (40);
• said step of applying glue including:
• placing said one component into said support;
• placing said another component into said another support;
• and
• carrying out with said machine (35) the following sequence of steps:
• driving said reservoir (36) and cliché (37) relative to one another from a rest position, in which the reservoir (36) is over, and releases the liquid glue into, an etched area (42A, 43A, 42B, 43B) and over, and releases the liquid glue into, another etched area (42A, 43A, 42B, 43B) of the cliché (37), to a working position, in which the reservoir (36) is away from the etched area and away from the another etched area;
• then driving simultaneously the transfer pad to a glue taking position in which the distal surface (43) of the transfer pad is in contact with the glue of the etched area of the cliché (37) and the another transfer pad to a glue taking position in which the distal surface (43) of the another transfer pad is in contact with the glue of the another etched area of the cliché (37);
• and then driving simultaneously the transfer pad from the glue taking position to a glue applying position in which the glue of the distal surface (43) of the transfer pad is in contact with said one surface of said one component and the another transfer pad from the glue taking position to a glue applying position in which the distal surface of the another transfer pad is in contact with said one surface of said another component, whereby said glue is applied simultaneously to said one surface of said one component and to said one surface of said another component.