Asymmetric processing method for reducing bow in laminate structures
AssigneeCorning Incorporated
InventorsJames Gregory Couillard, Michael Aaron McDonald, Paul George Rickerl
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Abstract
Disclosed herein are methods for making asymmetric laminate structures and methods for reducing bow in asymmetric laminate structures, the methods comprising differentially heating the laminate structures during lamination or differentially cooling the laminate structures after lamination. Also disclosed herein are methods for reducing bow in asymmetric laminate structures, the methods comprising subjecting at least one substrate in the laminate structure to asymmetric tempering or annealing prior to lamination. Further disclosed herein are laminate structures made according to such methods.
Claims13
A laminate structure comprising a first substrate, a second substrate, and an interlayer attaching the first and second substrates,
- wherein the second substrate is a glass substrate comprising a first surface and a second surface, the first surface having a compressive stress less than a compressive stress of the second surface;
- wherein the interlayer is positioned in direct contact with the second surface of the second substrate;
- wherein a coefficient of thermal expansion of the first substrate is different than a coefficient of thermal expansion of the second substrate;
- and
- wherein a minimum radius of curvature of the laminate structure at a temperature ranging from about −20° C. to about 90° C. is at least about 40 times greater than a maximum dimension of the laminate structure.
A method for making a laminate structure, comprising:
- positioning an interlayer between a first substrate and a second substrate to form a stack;
- and
- heating the stack to a lamination temperature to form a laminate structure;
- wherein the second substrate is a glass substrate comprising a first surface and a second surface, the first surface having a first compressive stress less than a second compressive stress of the second surface;
- wherein the interlayer is positioned in direct contact with the second surface of the second substrate;
- wherein a coefficient of thermal expansion of the first substrate is different than a coefficient of thermal expansion of the second substrate;
- and
- wherein a minimum radius of curvature of the laminate structure at a temperature ranging from about −20° C. to about 90° C. is at least about 40 times greater than a maximum dimension of the laminate structure.
Dependencies are inferred from the claim text.