Composition for forming conductive pattern and resin structure having conductive pattern

A resin structure having a conductive pattern, comprising:

• a polymer resin substrate;
• a non-conductive metal compound that is dispersed in the polymer resin substrate and is represented by Chemical Formula 1, and has a distorted square pyramidal structure, in which Cu or M is surrounded by five oxygen atoms, or a distorted octahedral structure, in which Cu or M is surrounded by six oxygen atoms;
• an adhesion-activated surface having a metal core which is exposed on the surface of a predetermined region of the polymer resin substrate;
• and
• a conductive metal layer formed on the adhesion-activated surface:
• Cu2−xMxP2O7 [Chemical Formula 1]
• wherein M is one or more metals selected from the group consisting of Zn, Mg, Ca, Sr and Ba, and x satisfies the condition of 0≤x<2.