Method for electrical coupling and electric coupling arrangement

A method for electrically coupling a pad and a front face of a pillar, comprising:

• shaping the front face of the pillar, the front face having at least partially a convex surface;
• applying a suspension to the front face of the pillar or to the pad, wherein the suspension includes a carrier fluid, electrically conducting microparticles suspended within the carrier fluid and electrically conducting nanoparticles suspended within the carrier fluid, wherein the suspension is applied as a droplet that adheres to the front face of the pillar or to the pad with surface tension;
• arranging the front face of the pillar opposite to the pad at a distance such that the carrier fluid bridges at least partially a gap between the front face of the pillar and the pad;
• evaporating the carrier fluid thereby concurrently confining each of the microparticles and the nanoparticles, and thereby concurrently arranging the nanoparticles and the microparticles into percolation paths between the front face of the pillar and the pad;
• and
• sintering the arranged nanoparticles for forming metallic bonds at least between one of the nanoparticles or between the nanoparticles and the front face of the pillar or the pad.