Resin sealing apparatus and resin sealing method

A resin sealing apparatus for providing resin sealing for a component to be sealed by a sealing resin which is cured in a cavity, comprising:

• an upper mold on which a substrate is disposed, a component to be sealed being attached to the substrate;
• a lower mold provided to face the upper mold;
• a cavity provided at least in the lower mold;
• a bottom surface member forming an inner bottom surface of the cavity;
• a side surface member forming a side surface of the cavity;
• an opening provided in the side surface member and corresponding to an outer circumference of the bottom surface member;
• an opening circumferential edge portion provided in the side surface member and having an inner edge shape formed to correspond to an outer edge of an end surface planar shape, an end surface of the sealing resin having the end surface planar shape;
• an inclined surface portion provided in the side surface member and inclined to expand upwardly from the opening circumferential edge portion,
• a frame-like member provided to surround a mold having at least the upper mold and the lower mold;
• a space surrounded by the frame-like member and including the cavity;
• a seal member for shutting off the space from ambient air;
• and
• a pressure reducing mechanism for reducing pressure of the space with the space being shut off from the ambient air, wherein
• the side surface member being fitted to the outer circumference of the bottom surface member so as to be slidable on the outer circumference, and
• during a period from when the space is shut off from the ambient air to when a step of clamping the upper mold and the lower mold is completed, the pressure of the space shut off from the ambient air is reduced by the pressure reducing mechanism.