Reduced stress pressure sensor

A method for manufacturing a pressure sensor comprising:

• providing a first substrate with a processing circuit integrated thereon;
• providing a second substrate;
• providing a third substrate;
• manufacturing a cavity in the second substrate and one or more trenches around a first, portion of the second substrate containing the cavity;
• mounting said third substrate to said second substrate to form a container, a holder, and two or more suspension elements to concentrically suspend the holder, wherein the two or more suspension elements are disposed on a back side of the second substrate for suspending the container from the holder, and wherein the holder includes the cavity and a polysilicon layer, wherein the cavity is closed on a front side of the container and between the polysilicon layer of the container and further closed by a deformable membrane, wherein the deformable membrane is configured for sensing a pressure applied to the deformable membrane, wherein the deformable membrane separates the cavity and a port that is positioned on the back side of the second substrate and is open to an, outside of the pressure sensor, and wherein a permeable protection membrane that is permeable to pressure is disposed on the back side of the second substrate and covers a recess formed on a back side of the container;
• and
• mounting the assembly of the second substrate and the third substrate to the first substrate with the deformable membrane facing the first substrate and providing a gap between the deformable membrane and the first substrate wherein the deformable membrane faces the first substrate and wherein the gap contributes to the port.