Method and apparatus for delivering power to semiconductors

A method of supplying power received from an input source at an input voltage to circuitry on one or more semiconductor chips mounted in or on a semiconductor package at a DC output voltage, comprising:

• providing a driver circuit for deployment outside or off the semiconductor package having an input for receiving power from the source, circuitry adapted to drive a transformer, and a driver output;
• providing one or more output circuits for deployment in or on the semiconductor package, each output circuit including a printed circuit board, a power transformer including a first winding and a second winding, an input connected to the first winding for receiving AC power from the driver output, a rectification circuit connected to the second winding for rectifying power received from the transformer, and an output connected to the rectification circuit for supplying DC power to the one or more semiconductor chips;
• providing a power bus for carrying AC power from the driver output to the input of each of the one or more output circuits in the semiconductor package;
• operating the driver circuit to drive the transformer in a series of converter operating cycles, each converter operating cycle characterized by two power transfer phases of essentially equal duration during which one or more switches in the driver circuit are ON and power is transferred from the input to the output via the transformer;
• and
• deploying the driver circuit at a first location outside or off of the semiconductor package;
• wherein power is supplied to the semiconductor package by the driver circuit at a bus voltage that is a multiple, X, times greater than a load voltage required by the one or more semiconductor chips.