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US 10,150,277 B2Granted
Connection element, connection arrangement, method for producing a connection element and method for producing a connection arrangement
AssigneeAirbus Defence and Space GmbH
InventorThomas Meer
Life of this patent
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Abstract
A connection element includes a composite component with a cured epoxy resin, a first layer including a first thermoplastic polymer and an intermediate layer arranged between the composite component and the first layer, the first layer containing both the cured epoxy resin of the composite component and the first thermoplastic polymer of the first layer. The first thermoplastic polymer has a melting point above a curing temperature of the epoxy resin and is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component.
Claims34
A connection element comprising:
- a composite component comprising a cured epoxy resin;
- a first layer comprising a first thermoplastic polymer;
- an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer;
- wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin;
- wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component;
- wherein the curing temperature of the epoxy resin is up to 180° C.;
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.;
- and
- wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer.
6 more elements
A connection arrangement comprising:
- a connection element comprising:
- a composite component comprising a cured epoxy resin;
- a first layer comprising a first thermoplastic polymer;
- and
- an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer;
- wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin;
- wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component;
- wherein the curing temperature of the epoxy resin is up to 180° C.;
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 18° C., in particular higher than 200° C.;
- and
- wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer;
- and
- a component connected to the connection element, wherein the component is welded to the first layer of the connection element.
10 more elements
A connection arrangement comprising:
- a connection element comprising:
- a composite component comprising a cured epoxy resin:
- a first layer comprising a first thermoplastic polymer:
- an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer and
- a second layer comprising a second thermoplastic polymer arranged on the first layer;
- wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin,
- wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component;
- wherein the curing temperature of the epoxy resin is up to 180° C.;
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.;
- and
- wherein the epoxy resin extends into the intermediate layer, from the composite component towards the first layer, in a form of a number of volume portions which are mutually adjacent or interconnected at least in part, wherein the volume portions are configured as bubbles and have, in a region of the intermediate layer that is adjacent to the composite component, a diameter or a volume that is greater than in a region of the intermediate layer that is adjacent to the first layer;
- and
- a component connected to the connection element, wherein the component is welded to the second layer of the connection element.
10 more elements
A method for manufacturing a connection element, the method comprising:
- providing a raw composite component comprising at least one uncured epoxy resin;
- applying a first layer comprising a first thermoplastic polymer to the raw composite component, the first thermoplastic polymer having a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin;
- and
- curing the raw composite component at a temperature of at least 150° C., the first thermoplastic polymer dissolving at a temperature of at least 150° C. in the at least one uncured epoxy resin,
- wherein the curing temperature of the epoxy resin is up to 180° C., and
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.
3 more elements
A method for producing a connection arrangement, the method comprising:
- providing a connection element comprising:
- a composite component comprising a cured epoxy resin:
- a first layer comprising a first thermoplastic polymer:
- an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer
- wherein the first thermoplastic polymer has a melting point, in particular a glass transition temperature, above a curing temperature of the epoxy resin;
- wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component;
- wherein the curing temperature of the epoxy resin is up to 180° C., and
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C. and
- welding a component, which is configured to be connected to the connection element, to the first layer of the connection element by friction welding.
6 more elements
A method for producing a connection arrangement, the method comprising:
- providing a connection element comprising:
- a composite component comprising a cured epoxy resin;
- a first layer comprising a first thermoplastic polymer;
- an intermediate layer arranged between the composite component and the first layer and containing both the epoxy resin of the composite component and the first thermoplastic polymer of the first layer;
- and
- a second layer comprising a second thermoplastic polymer arranged on the first layer;
- wherein the first thermoplastic polymer has a melting point, in particular glass transition temperature, above a curing temperature of the epoxy resin;
- wherein the first thermoplastic polymer is soluble at a temperature of at least 150° C. in the epoxy resin used for producing the composite component;
- wherein the curing temperature of the epoxy resin is up to 180° C.;
- and
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.;
- and
- welding a component, which is configured to be connected to the connection element, to the second layer of the connection element by friction welding.
10 more elements
A method for producing a connection arrangement comprising:
- providing a connection element produced by a method comprising:
- providing a raw composite component comprising at least one uncured epoxy resin;
- applying a first layer comprising a first thermoplastic polymer to the raw composite component, the first thermoplastic polymer having a melting point, in particular glass transition temperature, above a curing temperature of the epoxy resin;
- and
- curing the raw composite component at a temperature of at least 150° C., the first thermoplastic polymer dissolving at a temperature of at least 150° C. in the at least one uncured epoxy resin;
- wherein the curing temperature of the epoxy resin is up to 180° C.;
- and
- wherein the glass transition temperature of the first thermoplastic polymer is higher than 185° C., in particular higher than 200° C.;
- and
- welding a component, which is configured to be connected to the connection element, to the first layer of the connection element by friction welding.
7 more elements
Dependencies are inferred from the claim text.