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US 10,148,244 B1Granted
Trimming method for microresonators and microresonators made thereby
AssigneeNational Technology & Engineering Solutions of Sandia, LLC
InventorsMichael David Henry, Janet Nguyen, Matt Eichenfield, Roy H. Olsson
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Abstract
A micromechanical resonator is disclosed. The resonator includes a resonant micromechanical element. A film of annealable material deposited on a facial surface of the element. In one instance, the resonance of the element can be adjusting by using a feedback loop to control annealing of the deposited film.
Claims20
A method for fabricating at least one resonant device, the method comprising:
- identifying a desired common resonator frequency for at least one resonant element, each resonant element having a film of annealable material on at least one surface, each resonant element comprising piezoelectric material;
- and
- adjusting a resonator frequency of the at least one resonant element using a feedback loop, the feedback loop comprising:
- measuring a first resonator frequency of the at least one resonant element,
- comparing the first resonator frequency to the desired common resonator frequency;
- and
- based on the comparing, shifting to a second resonator frequency of the at least one resonant element by annealing the film of annealable material at a first temperature, wherein the shifting is toward the desired common resonator frequency.
4 more elements
A system comprising:
- a heat source configured to anneal at least one resonant element, where the at least one resonant element comprises an annealable film deposited on at least one surface, where the at least one resonant element comprises piezoelectric material;
- a measurement device configured to measure a first resonant frequency of the at least one resonant element;
- and
- a controller coupled to the heat source and the measurement device, wherein the controller is configured to control annealing of the at least one resonant element using a feedback loop, the feedback loop comprising:
- receiving a measurement of the first resonator frequency of the at least one resonant element,
- comparing the first resonator frequency to a desired common resonator frequency;
- and
- based on the comparing, sending a control signal to the heat source to cause the at least one resonant element to shift to a second resonator frequency of the at least one resonant element to about the desired common resonator frequency by annealing the annealable film at a first temperature.
5 more elements
A wafer comprising a plurality of resonant elements and an annealable film deposited on a facial surface of each resonant element,
- wherein each of the plurality of resonant elements comprises a common resonator frequency,
- wherein the common resonator frequency is configured by using a feedback loop to repeatedly anneal the annealable film at one or more annealing temperatures until each of the plurality of resonant elements resonates at about the common resonator frequency, and
- wherein each of the plurality of resonant elements comprises piezoelectric material.
Dependencies are inferred from the claim text.