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US 10,147,693 B2Granted
Methods for stud bump formation
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChien Ling Hwang, Yeong-Jyh Lin, Yi-Li Hsiao, Ming-Da Cheng, Tsai-Tsung Tsai, Chung-Shi Liu, Mirng-Ji Lii, Chen-Hua Yu
Life of this patent
Estimating the term…
Abstract
An apparatus includes a spool configured to supply a wire, a cutting device configured to form a notch in the wire, and a capillary configured to bond the wire and to form a stud bump. The apparatus is further configured to pull the wire to break at the notch, with a tail region attached to the stud bump.
Claims20
A method comprising:
- supplying a wire from a spool;
- pushing a capillary through blades of a spring blade to open the spring blade, wherein the wire passes the blades of the spring blade along with the capillary;
- bonding using the capillary the wire onto an electrical connector and forming a stud bump on the electrical connector;
- after the bonding, pulling the capillary back to allow the spring blade to snap back, wherein the spring blade cuts the wire to form a notch;
- and
- pulling the wire to break the wire from the stud bump at the notch.
3 more elements
A method comprising:
- supplying a metal wire through a channel in a capillary;
- moving the capillary along with the metal wire toward a bond pad, wherein the capillary pushes arms of a spring blade, so that blades of the spring blade contacting each other are opened to allow the capillary to pass through;
- bonding the wire onto the bond pad to form a stud bump;
- pulling back the capillary, so that the spring blade cuts the metal wire;
- and
- continuing pulling back the capillary to break the metal wire.
3 more elements
A method comprising:
- supplying a wire from a spool;
- pushing a capillary against blades of a spring blade to open the spring blade, wherein the wire passes through the capillary and the blades;
- bonding using the capillary the wire onto an electrical connector and forming a stud bump on the electrical connector;
- after the bonding, pulling the capillary back to allow the spring blade to snap back, wherein blades of the spring blade move against each other to form a notch in the wire;
- and
- pulling the wire to break the wire from the stud bump at the notch.
3 more elements
Dependencies are inferred from the claim text.