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US 10,141,108 B2Granted
Apparatus and method for manufacturing electronic component
AssigneeNittoku Engineering Co., Ltd.
InventorKenichi Muto
Life of this patent
Estimating the term…
Abstract
An apparatus for manufacturing an electronic component includes a grip unit configured to grip an electronic member having a plurality of projections arranged thereon, a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another, and a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.
Claims5
An apparatus for manufacturing an electronic component, the apparatus comprising:
- a grip unit configured to grip an electronic member having a plurality of projections arranged thereon;
- a connected coil assembly forming unit configured to form a connected coil assembly in which a plurality of single coils are connected to one another;
- and
- a coil mounting unit configured to sequentially mount the plurality of single coils of the connected coil assembly on the plurality of projections.
1 more element
A method for manufacturing an electronic component, the method comprising:
- preparing and gripping a base plate having a plurality of projections arranged thereon;
- forming a connected coil assembly in which a plurality of single coils are connected to one another;
- and
- mounting the connected coil assembly on the base plate,
- wherein the method comprises, in mounting the connected coil assembly, sequentially mounting the plurality of single coils of the connected coil assembly on the plurality of projections while moving the base plate relative to the connected coil assembly.
2 more elements
Dependencies are inferred from the claim text.