Electronic device

An electronic device, comprising:

• an anisotropic conductive film, the anisotropic conductive film including an insulating layer and a conductive layer laminated on the insulating layer, the conductive layer containing insulating particles and conductive particles, wherein,
• the lowest melt viscosity of the insulating layer is in the range of about 2,000 Pa·s to about 10,000 Pa·s and the lowest melt viscosity of the conductive layer is in the range of about 5,000 to about 50,000 Pa·s, provided that the lowest melt viscosity of the conductive layer is at least about 3,000 Pa·s greater than that of the insulating layer,
• the insulating layer is from greater than 1 to about 4 times thicker than the conductive layer,
• the insulating layer is formed from a first composition that comprises a first polymer resin, a first radically polymerizable material, and a first radical initiator, wherein the first polymer resin includes one or more of an olefinic resin, a butadiene resin, an acrylonitrile-butadiene copolymer, a carboxyl-terminated acrylonitrile-butadiene copolymer, a polyimide resin, a polyamide resin, a polyester resin, a polyvinyl butyral resin, an ethylene-vinyl acetate copolymer, a styrene-butylene-styrene (SBS) resin, a styrene-ethylene-butylene-styrene (SEBS) resin, an acrylonitrile-butadiene rubbers (NBRs), a urethane resin, a (meth)acrylic resin, or a phenoxy resin, and the first radically polymerizable material includes a first epoxy (meth)acrylate oligomer, the first epoxy (meth)acrylate oligomer being present in an amount of 20 to 40 wt %, based on a total weight of the first composition,
• the conductive layer is formed from a second composition that comprises a second polymer resin, a second radically polymerizable material, and a second radical initiator, wherein the second polymer resin includes one or more of an olefinic resin, a butadiene resin, an acrylonitrile-butadiene copolymer, a carboxyl-terminated acrylonitrile-butadiene copolymer, a polyimide resin, a polyamide resin, a polyester resin, a polyvinyl butyral resin, an ethylene-vinyl acetate copolymer, a styrene-butylene-styrene (SBS) resin, a styrene-ethylene-butylene-styrene (SEBS) resin, an acrylonitrile-butadiene rubbers (NBRs), a urethane resin, a (meth)acrylic resin, or a phenoxy resin, and the second radically polymerizable material includes a second epoxy (meth)acrylate oligomer, the second epoxy (meth)acrylate oligomer being present in an amount of 20 to 30 wt %, based on a total weight of the second composition,
• a size of the conductive particles is in the range of about 1 to about 30 μm, the conductive particles being present in an amount of about 1 to about 30% by weight, based on the total weight of the second composition,
• a size of the insulating particles is in the range of about 0.1 to about 20 μm, the insulating particles being present in an amount of about 2 to about 20% by weight, based on the total weight of the second composition.