Monitoring device, monitoring method, and device for cutting and grinding display substrate

A monitoring method for monitoring a process of cutting a display substrate, comprising:

• detecting, by an infrared temperature detection module, a temperature at a contacting position where a cutter wheel is in contact with the display substrate when cutting the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position;
• and
• generating, by a processing module, a corresponding control parameter for controlling the process of cutting procedure the display substrate, based on the temperature parameter;
• wherein the cutter wheel is mounted to a cutter holder;
• and the cutter holder comprises:
• a center shaft passing through a center of the cutter wheel;
• a first pressure application unit connected to a first end of the center shaft;
• a second pressure application unit connected to a second end of the center shaft;
• a first pressure detection unit configured to detect a pressure at the first end of the center shaft;
• and
• a second pressure detection unit configured to detect a pressure at the second end of the center shaft;
• wherein the first end and the second end of the center shaft are located at two sides of the cutter wheel, respectively;
• wherein the monitoring method further includes:
• using the first pressure detection unit to detect the pressure at the first end of the center shaft and using the second pressure detection unit to detect the pressure at the second end of the center shaft;
• determining whether the pressure at the first end of the center shaft is equal to the pressure at the second end of the center shaft;
• and
• when the pressure at the first end of the center shaft is not equal to the pressure at the second end of the center shaft, using at least one of the first pressure application unit and the second pressure application unit to adjust at least one of the pressure at the first end of the center shaft and the pressure at the second end of the center shaft.

A device for cutting a display substrate, comprising a cutter wheel and a monitoring device for monitoring a process of cutting the display substrate;

• wherein the monitoring device comprises:
• an infrared temperature detection module configured to detect a temperature at a contacting position where the cutter wheel is in contact with the display substrate when cutting the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position;
• and
• a processing module in communication with the infrared temperature detection module, and configured to generate, based on the temperature parameter, a corresponding control parameter for controlling the process of cutting the display substrate;
• wherein the device further includes a cutter holder;
• wherein the cutter holder comprises:
• a center shaft passing through a center of the cutter wheel;
• a first pressure application unit connected to a first end of the center shaft;
• a second pressure application unit connected to a second end of the center shaft;
• a first pressure detection unit configured to detect a pressure at the first end of the center shaft;
• and
• a second pressure detection unit configured to detect a pressure at the second end of the center shaft;
• wherein the first end and the second end of the center shaft are located at two sides of the cutter wheel, respectively.