Sealant composition and method of preparing the same

A method of preparing a sealant composition, wherein the sealant composition comprises:

• (a) from >75 wt % to 80 wt % of a low-viscosity epoxy acrylate conforming to the structure of Formula I;
• wherein R1 and R2 are each independently selected from the group consisting of methyl, ethyl, propyl, isopropyl, butyl, isobutyl, and tert-butyl;
• (b) 0.5-1 wt % of a photoinitiator;
• (c) 5-15 wt % of silica microspheres having a diameter of 0.5-0.9 μm;
• (d) 5-15 wt % of resinous elastic microspheres;
• and
• (e) 1-2 wt % of silane coupling agent,
• based on a total weight of the sealant composition,
• the method comprising:
• mixing and stirring all components, except the low-viscosity epoxy acrylate, at a temperature of 20-30° C. for 30-60 min;
• compounding the mixture at a temperature of 30° C.-50° C. twice, each time for 20-40 min;
• degassing the compounded mixture;
• and then adding the low-viscosity epoxy acrylate to adjust a viscosity of the degassed compounded mixture, to produce the sealant composition.