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US 10,129,976 B2Granted
High performance, ultra low loss, ultra lightweight, multi-layered rigid circuit boards
AssigneeNorthrop Grumman Systems Corporation
InventorsDaniel J. Braley, Eric G. Barnes, Pedro Gonzalez
Life of this patent
Estimating the term…
Abstract
An electronic component, such as a circuit board, fabricated by coextruding an Ultra High Molecular Weight Polyethylene (UHMWPE) filament, such as a Dyneema® filament, and a conductive material, such as an Indalloy wire, using only a three-dimensional printer, such as an FDM machine.
Claims15
A method for fabricating an electronic component made of only Dyneema® and Indalloy, said method comprising:
- providing a spool of a Dyneema® filament and a spool of an Indalloy wire on a Fused Deposition Modeling (FDM) machine;
- feeding the Dyneema® filament to a first head of the FDM machine;
- feeding the Indalloy wire to a second head of the FDM machine;
- and
- coextruding the Dyneema® filament and the Indalloy wire to fabricate the electronic component using the FDM machine wherein said Dyneema filament and Indalloy wire are utilized in the fabricated electronic component without any further additives.
2 more elements
A method for fabricating an electronic component, said method comprising:
- providing a first spool of an Ultra High Molecular Weight Polyethylene (UHMWPE) filament and a second spool of a circuit material on a three-dimensional printer;
- feeding the UHMWPE filament from the first spool to a first head of the three-dimensional printer;
- feeding the circuit material from the second spool to a second head of the three-dimensional printer;
- providing a computing device that is programmed to provide predetermined operating parameters for the three-dimensional printer;
- and
- coextruding the UHMWPE and the circuit material to fabricate an electronic component using the three-dimensional wherein said Ultra High Molecular Weight Polyethylene (UHMWPE) filament and circuit material are utilized in the fabricated electronic component without any further additives printer.
3 more elements
Dependencies are inferred from the claim text.