US 10,128,764 B1Granted

Method and apparatus for delivering power to semiconductors

AssigneeVLT, Inc.

InventorPatrizio Vinciarelli

Life of this patent

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Abstract

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

Claims14

Dependent claims

An apparatus comprising:

a planar magnetic structure including a multilayer printed circuit board (PCB) having a first external surface, a second external surface, and conductive features arranged on conductive layers of the PCB to form one or more windings around one or more predetermined axes;
a hole in the PCB at each of the one or more predetermined axes, each hole having an inner edge aligned with an inner circumference of one of the windings;
a first magnetically permeable core section affixed to the first external surface of the PCB covering a selected hole or selected holes;
a second magnetically permeable core section affixed to the second external surface of the PCB covering the selected hole or selected holes;
a magnetically permeable fluid disposed in the selected hole or selected holes, wherein the effective magnetic permeability of the magnetically permeable fluid is 10 or greater;
and
wherein the magnetically permeable fluid is contained within the selected hole or selected holes.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/091,385Filed 5 Apr 2016 · continuation in part
Priority: 10 Aug 2015
Granted: 13 Nov 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification30 codes

H02M 3/33523
With automatic control of the output voltage or current, e.g. flyback converters: with galvanic isolation between input and output of both the…
H01F 1/44
Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties: of magnetic…
H01F 3/10
Cores, Yokes, or armatures: composite arrangements of magnetic circuits
H01F 27/2804
Coils; Windings; Conductive connections: printed windings