Wound/stacked ceramic film capacitors, method for making ceramic film capacitors
AssigneeUchicago Argonne, LLC
InventorsBeihai Ma, Uthamalingam Balachandran, Stephen E. Dorris, Tae H. Lee
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Abstract
The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric.
Claims15
A capacitor comprising:
- a. a flexible polymer-based single substrate acting as a support substrate wherein said single flexible polymer-based substrate comprises a film;
- b. a first electrode deposited upon said flexible polymer-based substrate at near ambient pressure;
- c. a dielectric fully overlaying the first electrode;
- and
- d. a second electrode deposited on said dielectric;
- wherein said dielectric comprises a ceramic film deposited on the first electrode and flexible polymer-based substrate combination wherein said ceramic film exhibits a high dielectric constant wherein combination of said support substrate, first electrode, dielectric, and second electrode form the capacitor.
Dependencies are inferred from the claim text.