US 10,123,407 B2Granted

Transmission line structure having orthogonally oriented transmission line segments connected by vias extending through a substrate body

AssigneeChung Yuan Christian University

InventorGuang-Hwa Shiue

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Abstract

A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.

Claims8

Dependent claims

A structure of a transmission line adapted for a substrate having a body, a first signal transmission layer, a second signal transmission layer, wherein the first signal transmission layer and the second signal transmission layer are disposed in parallel and insulated from each other, the structure of the transmission line, comprising:

a first transmission line, comprising:
a first line segment disposed in the first signal transmission layer and extending along a first direction;
a second line segment disposed in the second signal transmission layer and extending along a second direction perpendicular to the first direction;
and
a first signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the first line segment and the second line segment;
a second transmission line, comprising:
a third line segment disposed in the first signal transmission layer and extending along the first direction and partially overlapped by an orthogonal projection of the second line segment onto the first signal transmission layer;
a fourth line segment disposed in the second signal transmission layer and extending along the second direction;
and
a second signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the third line segment and the fourth line segment;
and
at least one inter-layer via adjacent to the first line segment or the third line segment and disposed within a predetermined distance from the first signal via and perpendicularly connected to the first signal transmission layer and the second signal transmission layer;
wherein both the first signal transmission layer and the second signal transmission layer are disposed in the body, and the body has a first dielectric coefficient, and
wherein the at least one inter-layer via has a second dielectric coefficient less than the first dielectric coefficient.

11 more elements

a first transmission line, comprising:
a first line segment disposed in the first signal transmission layer and extending along a first direction;
a second line segment disposed in the second signal transmission layer and extending along a second direction perpendicular to the first direction;
and
a first signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the first line segment and the second line segment;
a second transmission line, comprising:
a third line segment disposed in the first signal transmission layer and extending along the first direction and partially overlapped by an orthogonal projection of the second line segment onto the first signal transmission layer;
a fourth line segment disposed in the second signal transmission layer and extending along the second direction;
and
a second signal via disposed in the body and perpendicular to the first signal transmission layer and connected to the third line segment and the fourth line segment;
and
at least one inter-layer via adjacent to the first line segment or the third line segment and disposed within a predetermined distance from the first signal via and perpendicularly connected to the first signal transmission layer and the second signal transmission layer;
wherein both the first signal transmission layer and the second signal transmission layer are disposed in the body, and the body has a first dielectric coefficient;
wherein the first signal via has a first diameter, the second signal via has a second diameter, the at least one inter-layer via has a third diameter, the first diameter and the second diameter are both less than the third diameter.

11 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/293,225Filed 13 Oct 2016
Priority: TW 105119242 A17 Jun 2016
Published: US 2017/0365905 A121 Dec 2017
Granted: 6 Nov 2018
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

H05K 1/0251
Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance: related to vias or transitions between vias and transmission lines
H01P 1/20381
Non-comb or non-interdigital filters: special shape resonators
H01P 3/04
With two longitudinal conductors: lines formed as Lecher wire pairs
H01P 3/08
With two longitudinal conductors: microstrips; Strip lines