# US 10,122,903 B2 · Bezels for die level packaging of camera modules, and associated camera modules and methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,903 B2 - Document ID: US10122903B2 - Status: Granted - Kind: B2 - Application number: 15/193,031 - Filed: 2016-06-25 - Published: 2017-12-28 - Granted: 2018-11-06 - Earliest claimed: 2016-06-25 - Assignees: OmniVision Technologies, Inc. - Applicants: OmniVision Technologies, Inc. - Inventors: Wei-Ping Chen; Tsung-Wei Wan - Web page: https://patentgrep.com/patent/US10122903B2 ## CPC - H04N 23/57: Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices - H04N 23/51: Housings - H04N 23/54: Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils - H04N 23/55: Optical parts specially adapted for electronic image sensors; Mounting thereof - H10F 39/026: {Wafer-level processing} - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION ## Abstract A bezel for die level packaging of a camera module may include (a) a recessed lip surrounding an aperture of the bezel and facing in a first direction, wherein the recessed lip is configured for seating thereon an image sensor, and (b) a planar rim surrounding the aperture and facing in a second direction opposite the first direction, wherein the planar rim is configured for bonding thereto a wafer-level lens unit implementing a wafer-level lens for delivering light to the image sensor through the aperture, wherein transverse extent of the planar rim across the aperture in a dimension orthogonal to the first direction exceeds corresponding transverse extent of the recessed lip. ## Claims ### Claim 1 A lens-bezel assembly for die level packaging of a camera module, comprising: a recessed lip surrounding an aperture of the bezel and facing in a first direction, the recessed lip being configured for seating thereon an image sensor; a planar rim adjacent and surrounding the aperture and facing in a second direction opposite the first direction, transverse extent of the planar rim across the aperture in a second dimension orthogonal to the first direction exceeding corresponding transverse extent of the recessed lip; and a wafer-level lens unit for delivering light to the image sensor through the aperture, the wafer-level lens unit including: (a) a first wafer-level lens, including a substrate and at least one lens element disposed on the substrate, and (b) a spacer bonded between the substrate and the planar rim, to couple the first wafer-level lens to the bezel, the spacer forming an opening around optical pathway for the light propagating from the wafer-level lens to a light-receiving surface of the image sensor, transverse extent of the opening, in the second dimension, exceeding the corresponding transverse extent of the recessed lip. ### Claim 2 (depends on 1) The bezel of claim 1, further comprising a flange surrounding the planar rim to retain glue used to bond the wafer-level lens unit to the planar rim. ### Claim 3 A lens-bezel assembly for die level packaging of a camera module, comprising: a recessed lip surrounding an aperture of the bezel and facing in a first direction, the recessed lip being configured for seating thereon an image sensor; a planar rim surrounding the aperture and facing in a second direction opposite the first direction transverse extent of the planar rim across the aperture in a second dimension orthogonal to the first direction exceeding corresponding transverse extent of the recessed lip; a flange surrounding the planar rim to retain glue used to bond the wafer-level lens unit to the planar rim; a wafer-level lens unit for delivering light to the image sensor through the aperture, the wafer-level lens unit including: (a) a first wafer-level lens, including a substrate and at least one lens element disposed on the substrate, and (b) a spacer bonded between the substrate and the planar rim, to couple the first wafer-level lens to the bezel, the spacer forming an opening around optical pathway for the light propagating from the wafer-level lens to a light-receiving surface of the image sensor, transverse extent of the opening, in the second dimension, exceeding the corresponding transverse extent of the recessed lip; and a second lip configured for seating thereon a wavelength filter for spectrally filtering the light, the second lip (a) surrounding the aperture, (b) being surrounded by and recessed from the planar rim, and (c) facing in the second direction. ### Claim 4 (depends on 1) The bezel of claim 1, the recessed lip and the planar rim having rectangular outer perimeter, in plane orthogonal to the first direction, to accommodate the wafer-level lens unit and the image sensor having rectangular cross section in dimensions orthogonal to the first direction. ### Claim 5 (depends on 1) The bezel of claim 1, being composed of an opaque polymer. ### Claim 6 A camera module, comprising: a wafer-level lens unit having first transverse extent in a first dimension orthogonal to optical axis of the wafer-level lens; an image sensor having second transverse extent, in a second dimension parallel to light-receiving surface of the image sensor, the second transverse extent being smaller than the first transverse extent; and a bezel having: (a) opposite facing first and second sides, the wafer-level lens unit being bonded to the first side and the image sensor being inserted into the second side and bonded directly to the bezel, such that the first dimension is aligned with the second dimension, and (b) an aperture configured to transmit light from the wafer-level lens to the light-receiving surface; the wafer-level lens unit including: (a) a first wafer-level lens, including a substrate and at least one lens element disposed on the substrate, and (b) a spacer bonded between the substrate and the bezel, to couple the first wafer-level lens to the bezel, the spacer forming an opening around optical pathway for the light propagating from the wafer-level lens to the light-receiving surface, the opening having third transverse extent in the first dimension, the third transverse extent exceeding the second transverse extent. ### Claim 7 (depends on 6) The camera module of claim 6, projection of the image sensor onto the spacer being entirely within the opening. ### Claim 8 (depends on 6) The camera module of claim 6, further comprising a glue layer bonding the wafer-level lens unit to the bezel. ### Claim 9 (depends on 8) The camera module of claim 8, thickness, along the optical axis, of the glue layer and the spacer cooperating to place the image sensor at image plane of the wafer-level lens unit. ### Claim 10 (depends on 8) The camera module of claim 8, the first side of the bezel comprising: a planar rim surrounding the aperture and configured for bonding the wafer-level lens unit thereto; and a flange surrounding the planar rim to retain the glue. ### Claim 11 (depends on 6) The camera module of claim 6, in dimensions orthogonal to the optical axis, the opening having rectangular outer perimeter, the spacer having rectangular outer perimeter, and the image sensor having rectangular cross section. ### Claim 12 (depends on 6) The camera module of claim 6, further comprising a wavelength filter for spectrally filtering the light; and the bezel further comprising: on the first side, a planar rim surrounding the aperture and configured for bonding the wafer-level lens unit thereto, and a lip configured for seating thereon the wavelength filter for spectrally filtering the light, the lip (i) surrounding the aperture, (ii) being surrounded by and recessed from the planar rim, and (iii) facing the wafer-level lens unit. ### Claim 13 (depends on 6) The camera module of claim 6, the bezel further comprising a recessed lip facing the image sensor, the image sensor being seated on the recessed lip. ### Claim 14 (depends on 6) The camera module of claim 6, the bezel being composed of an opaque polymer.