# US 10,122,837 B2 · Wireless communication device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,837 B2 - Document ID: US10122837B2 - Status: Granted - Kind: B2 - Application number: 15/463,974 - Filed: 2017-03-20 - Published: 2017-08-24 - Granted: 2018-11-06 - Earliest claimed: 2016-04-08 - Assignees: HTC Corporation - Applicants: Htc Corporation - Inventors: Tiao-Hsing Tsai; Chien-Pin Chiu; Hsiao-Wei Wu; Yi-Hsiang Kung; Li-Yuan Fang - Web page: https://patentgrep.com/patent/US10122837B2 ## CPC - G06F 3/0443: {using a single layer of sensing electrodes} - G05F 3/08: wherein the variable is DC - G06F 3/0418: {for error correction or compensation, e.g. based on parallax, calibration or alignment} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/24: with receiving set - H01Q 1/243: {with built-in antennas} - H01Q 1/44: using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) - H03K 17/74: by the use, as active elements, of diodes (by the use of more than one type of semiconductor device H03K17/567; by the use of tunnel diodes H03K17/58; by the use of negative resistance diodes H03K17/70) - H04B 1/0064: {with separate antennas for the more than one band (H04B1/0053 takes precedence)} - H04M 1/0277: {for a printed circuit board assembly} - H10D 8/50: PIN diodes - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 90/00: Package configurations - H04W 88/08: Access point devices - H10W 44/248: {for antennas} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - G05F: SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) - H04B: TRANSMISSION - H04M: TELEPHONIC COMMUNICATION (circuits for controlling other apparatus via a telephone cable and not involving telephone switching apparatus G08) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H04W: WIRELESS COMMUNICATION NETWORKS (broadcast communication H04H; communication systems using wireless links for non-selective communication, e.g. wireless extensions H04M1/72) ## Abstract A wireless communication device that has a circuit board, an RF signal module, a capacitive touch-sensing component, or a functional component, and an antenna component is provided. The touch-sensing signal module is disposed on the circuit board. The capacitive touch-sensing component includes a sensing layer and a ground layer. The sensing layer is electrically connected to the touch-sensing signal module. The antenna component includes a feed point and a radiating body. The feed point is disposed on the ground layer and is electrically connected to the RF single module. The radiating body incorporates at least parts of the ground layer. Alternatively, the feed point is disposed on the sensing layer, and the radiating body incorporates at least parts of the sensing layer. Therefore, the radiating body is incorporated into the sensing layer or ground layer of the capacitive touch-sensing component and can save accommodating space. ## Claims ### Claim 1 A wireless communication device, comprising: a circuit board, comprising a ground layer; a functional component, comprising a ground structure electrically connected to the ground layer; and an antenna component, comprising a feed point and a radiating body, the feed point being disposed on the ground structure of the functional component, and at least parts of the ground structure forming a first part of the radiating body. ### Claim 2 (depends on 1) The wireless communication device of claim 1, further comprising a ground conducting wire having a first end electrically connected to the ground layer and a second end electrically connected to the ground structure. ### Claim 3 (depends on 2) The wireless communication device of claim 2, further comprising a radio frequency (RF) signal conducting wire having a first end electrically connected to the ground structure. ### Claim 4 (depends on 3) The wireless communication device of claim 3, wherein the ground conducting wire and the RF signal conducting wire form a second part of the radiating body. ### Claim 5 (depends on 4) The wireless communication device of claim 4, further comprising: an RF signal module and a functional signal module, both being disposed on the circuit board; and a functional signal conducting wire having a first end electrically connected to the functional signal module and a second end electrically connected to the functional component, and the first end of the RF signal conducting wire being electrically connected to the RF signal module. ### Claim 6 (depends on 5) The wireless communication device of claim 5, wherein the functional signal conducting wire and the RF signal conducting wire are disposed on one of the circuit board and/or a flexible printed circuit substrate. ### Claim 7 (depends on 5) The wireless communication device of claim 5, further comprising an RF signal filter, wherein the RF signal filter is electrically connected to the functional signal conducting wire to block an RF signal from propagating through the functional signal conducting wire. ### Claim 8 (depends on 7) The wireless communication device of claim 7, wherein the RF signal filter comprises an inductor, a resistor or a ferrite bead. ### Claim 9 (depends on 2) The wireless communication device of claim 2, further comprising an RF signal filter, wherein the RF signal filter is electrically connected to the ground conducting wire to block an RF signal from propagating through the ground conducting wire. ### Claim 10 (depends on 9) The wireless communication device of claim 9, wherein the RF signal filter comprises an inductor, a resistor or a ferrite bead. ### Claim 11 (depends on 3) The wireless communication device of claim 3, further comprising a functional signal filter, wherein the functional signal filter is electrically connected to the RF signal conducting wire to block an RF signal from propagating through the RF signal conducting wire. ### Claim 12 (depends on 11) The wireless communication device of claim 11, wherein the functional signal filter comprises a capacitor, an inductor, a resistor or a ferrite bead. ### Claim 13 (depends on 1) The wireless communication device of claim 1, wherein the functional component comprises a microphone, a camera, a speaker, a vibrator, a proximity sensor, an ambient light sensor or a LED indicator.