# US 10,122,463 B2 · Method and system for a photonic interposer > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,463 B2 - Document ID: US10122463B2 - Status: Granted - Kind: B2 - Application number: 15/796,063 - Filed: 2017-10-27 - Published: 2018-03-08 - Granted: 2018-11-06 - Earliest claimed: 2008-09-08 - Assignees: Luxtera, Inc. - Applicants: Luxtera, Inc. - Inventors: Mark Peterson; Greg Young; Peter De Dobbelaere - Web page: https://patentgrep.com/patent/US10122463B2 ## CPC - H04B 10/43: using a single component as both light source and receiver, e.g. using a photoemitter as a photoreceiver - G02B 6/1225: {comprising photonic band-gap structures or photonic lattices} - H04B 10/70: Photonic quantum communication - H04B 10/801: {using optical interconnects, e.g. light coupled isolators, circuit board interconnections} - H10D 86/01: Manufacture or treatment - H10D 86/201: {the substrates comprising an insulating layer on a semiconductor body, e.g. SOI (H10D86/40 take precedence)} - H10W 70/635: {Through-vias} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/66: Conductive materials thereof - H10W 90/00: Package configurations - G02B 2006/12061: {Silicon} - G02B 2006/12142: {Modulator} - H10W 72/884: {Die-attach connectors and bond wires} - H04B: TRANSMISSION - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router. ## Claims ### Claim 1 A method for communication, the method comprising: in an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer: receiving a continuous wave (CW) optical signal in said silicon photonic interposer from an optical source coupled to said silicon photonic interposer via a first optical fiber; generating a first modulated optical signal in said silicon photonic interposer by processing said received CW optical signal based on a first electrical signal received from one of said one or more CMOS electronics die; communicating said first modulated optical signal out of said photonic interposer via a second optical fiber; receiving a second modulated optical via a third optical fiber; and generating a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal. ### Claim 2 (depends on 1) The method according to claim 1, comprising communicating said second electrical signal to said CMOS electronics die via copper pillars. ### Claim 3 (depends on 1) The method according to claim 1, comprising generating said CW optical signal in an optical source assembly external to said silicon photonic interposer. ### Claim 4 (depends on 1) The method according to claim 1, wherein said optical source assembly comprises a semiconductor laser. ### Claim 5 (depends on 1) The method according to claim 1, comprising processing said received CW optical signal utilizing an optical modulator in said silicon photonic interposer. ### Claim 6 (depends on 5) The method according to claim 5, wherein said optical modulator comprises a Mach-Zehnder interferometer modulator. ### Claim 7 (depends on 1) The method according to claim 1, comprising generating said second electrical signal in said silicon photonic interposer a photodetector integrated in said silicon photonic interposer. ### Claim 8 (depends on 1) The method according to claim 1, comprising receiving said CW optical source signal and said second modulated optical signal using grating couplers in said silicon photonic interposer. ### Claim 9 (depends on 1) The method according to claim 1, wherein said electronics die comprises one or more of: a processor core, a switch core, memory, or a router. ### Claim 10 (depends on 1) The method according to claim 1, wherein said integrated optical communication system comprises a plurality of transceivers. ### Claim 11 A system for communication, the system comprising: an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to: receive a continuous wave (CW) optical signal in said silicon photonic interposer from an optical source coupled to said silicon photonic interposer via a first optical fiber; generate a first modulated optical signal by processing said received CW optical signal based on a first electrical signal received from said CMOS electronics die; communicate said first modulated optical signal out of said photonic interposer via a second optical fiber; receive a second modulated optical via a third optical fiber; and generate a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal. ### Claim 12 (depends on 11) The system according to claim 11, wherein said integrated optical communication system is operable to communicate said second electrical signal to said CMOS electronics die via copper pillars. ### Claim 13 (depends on 11) The system according to claim 11, wherein said integrated optical communication system is operable to generate said CW optical signal in an optical source assembly external to said silicon photonic interposer. ### Claim 14 (depends on 13) The system according to claim 13, wherein said optical source assembly comprises a semiconductor laser. ### Claim 15 (depends on 11) The system according to claim 11, wherein said integrated optical communication system is operable to process said received CW optical signal utilizing an optical modulator in said silicon photonic interposer. ### Claim 16 (depends on 15) The system according to claim 15, wherein said optical modulator comprises a Mach-Zehnder interferometer modulator. ### Claim 17 (depends on 11) The system according to claim 11, wherein said integrated optical communication system is operable to generate said second electrical signal in said silicon photonic interposer utilizing a photodetector integrated in said silicon photonic interposer. ### Claim 18 (depends on 11) The system according to claim 11, wherein said integrated optical communication system is operable to receive said CW optical signal via grating couplers in said silicon photonic interposer. ### Claim 19 (depends on 11) The system according to claim 11, wherein said electronics die comprises one or more of: a processor core, a switch core, memory, or a router. ### Claim 20 A system for communication, the system comprising: an integrated optical communication system comprising a complementary metal-oxide semiconductor (CMOS) electronics die coupled to a silicon photonic interposer, said integrated optical communication system being operable to: receive a continuous wave (CW) optical signal in said photonics die from an optical source coupled to said silicon photonic interposer via an optical fiber; generate a first modulated optical signal by modulating said received CW optical signal based on a first electrical signal received from said CMOS electronics die; communicate said first modulated optical signal out of said silicon photonic interposer via a second optical fiber; receive a second modulated optical signal via a third optical fiber; and generate a second electrical signal in said silicon photonic interposer based on said received second modulated optical signal.