# US 10,122,420 B2 · Wireless in-chip and chip to chip communication

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- Number: US 10,122,420 B2
- Document ID: US10122420B2
- Status: Granted
- Kind: B2
- Application number: 14/979,185
- Filed: 2015-12-22
- Published: 2017-06-22
- Granted: 2018-11-06
- Earliest claimed: 2015-12-22
- Assignees: Intel IP Corporation
- Applicants: Intel IP Corporation
- Inventors: Thorsten Meyer; Andreas Augustin; Reinhard Golly; Peter Baumgartner
- Web page: https://patentgrep.com/patent/US10122420B2

## CPC

- H04B 5/26: using coils
- H04B 5/72: for local intradevice communication
- H10W 20/43: Layouts of interconnections
- H10W 20/497: {Inductive arrangements or effects of, or between, wiring layers}
- H10W 44/501: {Inductive arrangements (H10W44/20 takes precedence)}
- H10W 72/00: Interconnections or connectors in packages
- H10W 90/00: Package configurations
- H10W 70/63: Vias, e.g. via plugs
- H10W 72/07252: {changes in structures or sizes}
- H10W 72/227: {Multiple bumps having different sizes}
- H10W 90/28: the stacked chips having different sizes, e.g. chip stacks having a pyramidal shape
- H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H04B: TRANSMISSION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.

## Claims

### Claim 1

An apparatus to provide a simple and elegant wireless connection between integrated circuit dies, the apparatus comprising:
a first integrated circuit die including a plurality of integrated circuit devices and a first coil;
a second integrated circuit die including a second plurality of integrated circuit devices and a second coil; and
a wire;
a third coil coupled directly to a first end of the wire;
a fourth coil coupled directly to a second end of the wire; and
wherein the wire, the third coil, and the fourth coil are configured to wirelessly receive a signal from the first coil at the third coil, to conduct the signal from the first end of the wire to the second end of the wire, and to wirelessly transmit the signal from the fourth coil to the second coil.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein the wire does not include an amplifier.

### Claim 3 (depends on 1)

The apparatus of claim 1, including a non-conductive material positioned between the first coil and the third coil, the non-conductive material configured to enhance mutual inductance between the first coil and the second coil compared to an air gap between the first coil and the third coil.

### Claim 4 (depends on 1)

The apparatus of claim 1, including a non-conductive material positioned between the second coil and the fourth coil, the non-conductive material configured to enhance mutual inductance between the second coil and the fourth coil compared to an air gap between the third coil and the fourth coil.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the first integrated die and the second integrated circuit die are the same die.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein a printed circuit board includes the wire.

### Claim 7 (depends on 1)

The apparatus of claim 1, wherein the first integrated circuit die includes a mother integrated circuit die, and the second integrated circuit die includes a daughter integrated circuit die, the daughter integrated circuit die coupled to the mother integrated circuit die.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the first integrated circuit die includes a daughter integrated circuit die, the daughter integrated circuit die coupled to a mother integrated circuit die.

### Claim 9 (depends on 8)

The apparatus of claim 8, wherein the daughter integrated circuit die is coupled face-up with the mother integrated circuit die.

### Claim 10 (depends on 8)

The apparatus of claim 8, wherein the second integrated circuit die is the mother integrated circuit die.

### Claim 11 (depends on 1)

The apparatus of claim 1, including a semiconductor substrate that includes an electrically conductive portion of the wire.

### Claim 12

A method comprising:
electrically exciting a first coil coupled to a first integrated circuit die to provide a first wireless signal;
receiving the first wireless signal at a second coil to provide a second signal, the second coil coupled directly to a wire trace;
electrically conducting the second signal via the wire trace directly to a third coil, the third coil coupled directly to the wire trace;
electrically exciting the third coil using the second signal to provide a second wireless signal; and
wireless receiving the second wireless signal at a fourth coil, the fourth coil coupled to a second integrated circuit die.

### Claim 13 (depends on 12)

The method of claim 12, wherein the trace is a wire trace of a printed circuit board; and
wherein conducting the second signal includes conducting the second signal via the wire trace of the printed circuit board.

### Claim 14 (depends on 12)

The method of claim 12, wherein the second integrated circuit die includes an area of the first integrated circuit die remote from a location of the first coil.

### Claim 15 (depends on 12)

The method of claim 12, wherein the first integrated circuit die includes a daughter integrated circuit die, the daughter integrated circuit die coupled to a mother integrated circuit die.

### Claim 16 (depends on 15)

The method of claim 15, wherein the daughter integrated circuit die is coupled face-up with the mother integrated circuit die.

### Claim 17 (depends on 15)

The method of claim 15, wherein the second integrated circuit die is the mother integrated circuit die.

### Claim 18 (depends on 12)

The method of claim 12, wherein the first integrated circuit die includes a mother integrated circuit die, and the second integrated circuit die includes a daughter integrated circuit die.

### Claim 19 (depends on 12)

The method of claim 12, wherein the trace is a wire trace of a semiconductor substrate; and
wherein conducting the second signal includes conducting the second signal via the wire trace of the semiconductor substrate.