# US 10,122,366 B2 · Crystal oscillation device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,366 B2 - Document ID: US10122366B2 - Status: Granted - Kind: B2 - Application number: 15/333,619 - Filed: 2016-10-25 - Published: 2017-02-09 - Granted: 2018-11-06 - Earliest claimed: 2014-05-07 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Toru Morita; Toshiyuki Kakuya; Kenji Takayama - Web page: https://patentgrep.com/patent/US10122366B2 ## CPC - H03L 1/028: {of generators comprising piezoelectric resonators (H03L1/021, H03L1/022 take precedence; oscillation generators with a piezoelectric resonator H03B5/32)} - H03B 5/32: being a piezoelectric resonator (selection of piezoelectric material H10N30/00) - H03H 9/0504: {for bulk acoustic wave devices} - H03H 9/0519: {for cantilever (H03H9/1021 takes precedence)} - H03H 9/0552: {the device and the other elements being mounted on opposite sides of a common substrate} - H03H 9/10: Mounting in enclosures {(constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538)} - H03H 9/17: having a single resonator (crystal tuning forks H03H9/21) - H10N 30/50: having a stacked or multilayer structure - H10N 30/88: Mounts; Supports; Enclosures; Casings - H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) - H10W 40/10: Arrangements for heating - H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) - H03L: AUTOMATIC CONTROL, STARTING, SYNCHRONISATION OR STABILISATION OF GENERATORS OF ELECTRONIC OSCILLATIONS OR PULSES (generation of oscillations H03B) - H03B: GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS (generators adapted for electrophonic musical instruments G10H; masers or lasers H01S; generation of oscillations in plasma H05H) - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A crystal oscillation device in which crystal unit is mounted on a package board as a package material and the package board is joined to a mounting board by conductive joining materials. Moreover, a gap is provided between the package board and the mounting board other than portions joined by the conductive joining material and the conductive joining material. ## Claims ### Claim 1 A crystal oscillation device comprising: a first package material having opposing upper and lower surfaces; a crystal unit coupled to the upper surface of the first package material; a mounting board coupled to the lower surface of the first package material and defining a cavity in a portion of the mounting board; and a temperature-sensitive element coupled to the lower surface of the first package material and disposed at least partially in the cavity of the mounting board, wherein the mounting board is coupled to the lower surface of the first package material by a plurality of conductive joining materials, such that a gap is provided between the lower surface of the first package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the first package material, and wherein the mounting board includes first and second mounting board members spaced apart from each other to define the cavity, such that the temperature-sensitive element is disposed between the first and second mounting board members. ### Claim 2 (depends on 1) The crystal oscillation device according to claim 1, wherein a plurality of electrode lands are disposed on an upper surface of the mounting board, and the plurality of conductive joining materials respectively join the plurality of electrode lands to the first package material. ### Claim 3 (depends on 1) The crystal oscillation device according to claim 1, wherein the cavity of the mounting board surrounds the temperature-sensitive element. ### Claim 4 (depends on 1) The crystal oscillation device according to claim 1, wherein each of the first and second mounting board members comprises a strip shape. ### Claim 5 (depends on 1) The crystal oscillation device according to claim 1, wherein the first and second mounting board members comprise strip-shaped main bodies and first and second extension portions that each extend outward from the main body. ### Claim 6 (depends on 1) The crystal oscillation device according to claim 1, further comprising a second package material mounted on the first package material to form a sealed space with the crystal unit housed therein. ### Claim 7 (depends on 1) The crystal oscillation device according to claim 1, wherein the first package material is a package board. ### Claim 8 (depends on 1) The crystal oscillation device according to claim 1, wherein the crystal unit is coupled to the upper surface of the first package material by an electrode land. ### Claim 9 (depends on 8) The crystal oscillation device according to claim 8, wherein the crystal unit is attached to the first packaging material in a cantilevered manner. ### Claim 10 (depends on 1) The crystal oscillation device according to claim 1, wherein the crystal unit comprises a crystal substrate with a pair of electrodes disposed on opposite sides of the crystal substrate. ### Claim 11 (depends on 1) The crystal oscillation device according to claim 1, wherein the temperature-sensitive element is coupled to the lower surface of the first package material by a plurality of conductive bumps spaced apart from each other. ### Claim 12 A crystal oscillation device comprising: a first package material having opposing upper and lower surfaces; a crystal unit coupled to the upper surface of the first package material; a mounting board coupled to the lower surface of the first package material and defining a cavity in a portion of the mounting board; and a temperature-sensitive element coupled to the lower surface of the first package material and disposed at least partially in the cavity of the mounting board, wherein the mounting board is coupled to the lower surface of the first package material by a plurality of conductive joining materials, such that a gap is provided between the lower surface of the first package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the first package material, and wherein the mounting board comprises a shape of a frame body with a cutout portion in a plan view, such that an outer side portion and an inner side portion surrounded by the frame body communicate with each other. ### Claim 13 (depends on 12) The crystal oscillation device according to claim 12, wherein the frame body has a rectangular frame shape, and at least a portion of a side of the rectangular frame shape is cut out. ### Claim 14 A crystal oscillation device comprising: a package material having opposing upper and lower surfaces; a crystal unit coupled to the upper surface of the package material; a temperature-sensitive element coupled to the lower surface of the package material; and a mounting board coupled to the lower surface of the package material by a plurality of conductive joining materials, such that the mounting board at least partially surrounds the temperature-sensitive element, wherein a gap is provided between the lower surface of the package material and the mounting board other than where the plurality of conductive joining materials couple the mounting board to the package material, and wherein the mounting board includes first and second mounting board members spaced apart from each other, such that the temperature-sensitive element is disposed between the first and second mounting board members. ### Claim 15 (depends on 14) The crystal oscillation device according to claim 14, further comprising a plurality of electrode lands disposed on an upper surface of the mounting board, wherein the plurality of conductive joining materials respectively join the plurality of electrode lands to the package material. ### Claim 16 (depends on 14) The crystal oscillation device according to claim 14, wherein the mounting board has a cavity with the temperature-sensitive element positioned within the cavity. ### Claim 17 (depends on 14) The crystal oscillation device according to claim 14, wherein each of the first and second mounting board members comprises a strip shape. ### Claim 18 (depends on 14) The crystal oscillation device according to claim 14, wherein the first and second mounting board members comprise strip-shaped main bodies and first and second extension portions that each extend outward from the main body.