# US 10,122,339 B2 · Composite electronic component and board having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,339 B2 - Document ID: US10122339B2 - Status: Granted - Kind: B2 - Application number: 14/878,805 - Filed: 2015-10-08 - Published: 2016-05-19 - Granted: 2018-11-06 - Earliest claimed: 2014-11-14 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Won Sik Chong; Jae Young Park; Jong Young Kim; Woo Jin Choi - Web page: https://patentgrep.com/patent/US10122339B2 ## CPC - H03H 7/0115: {comprising only inductors and capacitors (H03H7/075, H03H7/09, H03H7/12, H03H7/13 take precedence)} - H01G 4/0085: {Fried electrodes} - H01G 4/012: Form of non-self-supporting electrodes - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/1227: {based on alkaline earth titanates} - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 4/40: Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations - H03H 1/0007: {of radio frequency interference filters} - H03H 7/427: {Common-mode filters (H02J3/01 and H02M1/126 takes precedence)} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body in which a common mode choke coil is disposed, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked. ## Claims ### Claim 1 A composite electronic component comprising: a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a common mode choke coil and having a plurality of side surfaces, and the multilayer ceramic capacitor array including a plurality of dielectric layers and having a plurality of side surfaces; first to fourth external electrodes disposed on two of the plurality of side surfaces of the common mode filter opposite each other and electrically connected to the common mode choke coil, and first and second connecting electrodes disposed on the two side surfaces of the common mode filter and insulated from the first to fourth external electrodes; and fifth to eighth external electrodes disposed on two of the plurality of side surfaces of the multilayer ceramic capacitor array, and third and fourth connecting electrodes disposed on the two side surfaces of the multilayer ceramic capacitor array and insulated from the fifth to eighth external electrodes, wherein the composite body includes first IC connection terminals and second IC connection terminals formed by coupling the first connecting electrode and the seventh external electrode and coupling the second connecting electrode and the eighth external electrode, respectively, first input terminals and second input terminals formed by coupling the fifth and first external electrodes and coupling the sixth and second external electrodes, respectively, and first output terminals and second output terminals formed by coupling the third external electrode and the third connecting electrode and coupling the fourth external electrode and the fourth connecting electrode, respectively, and wherein, in the multilayer ceramic capacitor array, a plurality of dummy dielectric layers are disposed between the plurality of dielectric layers on which internal electrodes of the capacitor array are disposed, wherein none of the plurality of dummy dielectric layers has an internal electrode disposed thereon. ### Claim 2 (depends on 1) The composite electronic component of claim 1, wherein the common mode filter and the multilayer ceramic capacitor array are coupled to each other by a conductive adhesive. ### Claim 3 (depends on 1) The composite electronic component of claim 1, wherein the plurality of dielectric layers and the plurality of dummy dielectric layers have different compositions. ### Claim 4 (depends on 1) The composite electronic component of claim 1, wherein the internal electrodes of the multilayer ceramic capacitor array includes first to fourth internal electrodes stacked therein and having leads exposed externally. ### Claim 5 (depends on 4) The composite electronic component of claim 4, wherein the fifth to eighth external electrodes are connected to the first to fourth internal electrodes, respectively. ### Claim 6 (depends on 4) The composite electronic component of claim 4, wherein the first to fourth internal electrodes are perpendicular to a mounting surface of the composite body. ### Claim 7 (depends on 4) The composite electronic component of claim 4, wherein the first to fourth internal electrodes are disposed in parallel with a mounting surface of the composite body. ### Claim 8 (depends on 1) The composite electronic component of claim 1, wherein a lower surface of the multilayer ceramic capacitor array is coupled to an upper surface of the common mode filter. ### Claim 9 A composite electronic component comprising: a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a common mode choke coil, and the multilayer ceramic capacitor array including a plurality of dielectric layers; and wherein the multilayer ceramic capacitor array includes a plurality of internal electrodes disposed on the plurality of dielectric layers and a plurality of dummy dielectric layers, wherein the plurality of dummy dielectric layers are disposed between the plurality of dielectric layers having the internal electrodes of the capacitor, and wherein none of the plurality of dummy dielectric layers has an internal electrode disposed thereon. ### Claim 10 (depends on 9) The composite electronic component of claim 9, wherein the plurality of dummy dielectric layers have a different composition than the plurality of dielectric layers.