# US 10,122,293 B2 · Power module package having a multi-phase inverter and power factor correction > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,293 B2 - Document ID: US10122293B2 - Status: Granted - Kind: B2 - Application number: 13/707,221 - Filed: 2012-12-06 - Published: 2013-07-18 - Granted: 2018-11-06 - Earliest claimed: 2012-01-17 - Assignees: Infineon Technologies Americas Corp. - Applicants: Infineon Technologies Americas Corp. - Inventors: Zhou Chen; Toshio Takahashi - Web page: https://patentgrep.com/patent/US10122293B2 ## CPC - H02M 7/537: using semiconductor devices only, e.g. single switched pulse inverters - H02M 1/4225: {using a non-isolated boost converter} - H02H 7/122: for inverters, i.e. DC/AC converters - H02M 1/007: {Plural converter units in cascade (push-pull DC/DC converters with pre-regulator H02M3/3374; DC-AC converters following a DC-DC stage including a high frequency transformer H02M7/4807; DC-AC converters following a DC-DC conversion stage generating periodically varying voltages H02M7/4826)} - H02M 1/0085: {Partially controlled bridges} - Y02B 70/10: Technologies improving the efficiency by using switched-mode power supplies [SMPS], i.e. efficient power electronics conversion e.g. power factor correction or reduction of losses in power supplies or efficient standby modes - Y02P 80/10: Efficient use of energy, e.g. using compressed air or pressurized fluid as energy carrier - H02M: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers H01F; dynamo-electric converters H02K47/00; controlling transformers, reactors or choke coils, control or regulation of electric motors, generators or dynamo-electric converters H02P) - H02H: EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS (indicating or signalling undesired working conditions G01R, e.g. G01R31/00, G08B; locating faults along lines G01R31/08; emergency protective devices H01H) - Y02B: CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS - Y02P: CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS ## Abstract According to an exemplary implementation, a power module package includes a multi-phase inverter. The power module package also includes a multi-phase inverter driver configured to drive the multi-phase inverter. The power module package further includes a power factor correction (PFC) circuit where the PFC circuit is configured to regulate a bus voltage of the multi-phase inverter and a PFC driver configured to drive the PFC circuit. The multi-phase inverter, the multi-phase inverter driver, the PFC circuit, and the PFC driver are situated on a package substrate of the power module package. The multi-phase inverter driver and the PFC driver can be in a common driver integrated circuit (IC). ## Claims ### Claim 1 A power module package comprising: a multi-phase inverter; a power factor correction (PFC) circuit, said PFC circuit configured to regulate a bus voltage of said multi-phase inverter; a common driver integrated circuit (IC) comprising a multi-phase inverter driver and a PFC driver, wherein the multi-phase inverter driver is configured to drive the multi-phase inverter, wherein the PFC driver is configured to drive said PFC circuit, said common driver IC, said multi-phase inverter, and said PFC circuit are disposed on a single substrate of said power module package, and said PFC circuit comprises a diode connected antiparallel with a PFC switch; a first external input terminal internally coupled to both the PFC circuit and the multi-phase inverter, the first external input terminal being configured to receive a high side DC voltage; a second external input terminal internally coupled to the PFC circuit and configured to receive a low side DC voltage; a third external input terminal internally coupled to the PFC circuit and configured to receive a PFC input voltage, wherein the PFC input voltage is a rectified version of an AC input voltage; and a plurality of external output terminals configured to output a multi-phase output, the plurality of external output terminals being coupled to the multi-phase inverter, wherein the first external input terminal, the second external input terminal, the third external input terminal, and the plurality of external output terminals are external connections of the power module package. ### Claim 2 (depends on 1) The power module package of claim 1, comprising a PFC overcurrent protection circuit configured to provide over current protection to said PFC circuit, wherein the multi-phase inverter driver, the PFC driver, and the PFC overcurrent protection circuit are disposed in the common driver IC. ### Claim 3 (depends on 1) The power module package of claim 1, comprising an inverter overcurrent protection circuit configured to provide over current protection to said multi-phase inverter, wherein the multi-phase inverter driver, the PFC driver, and the inverter overcurrent protection circuit are disposed in the common driver IC. ### Claim 4 (depends on 1) The power module package of claim 1, wherein said multi-phase inverter is a three-phase inverter. ### Claim 5 (depends on 1) The power module package of claim 1, comprising a common fault terminal of said power module package configured to indicate an overcurrent condition of said PFC circuit, indicate an overcurrent condition of said multi-phase inverter, and enable or disable switching of said PFC circuit and said multi-phase inverter. ### Claim 6 (depends on 1) The power module package of claim 1, wherein the single substrate is an insulated metal substrate (IMS). ### Claim 7 (depends on 1) The power module package of claim 1, wherein said PFC driver is configured to drive said PFC switch of said PFC circuit. ### Claim 8 (depends on 1) The power module package of claim 1, wherein the single substrate is a direct bonded copper (DBC) substrate. ### Claim 9 (depends on 1) The power module package of claim 1, wherein the single substrate is a leadframe-based substrate. ### Claim 10 (depends on 1) The power module package of claim 1, further comprising a plurality of inverter terminals, wherein: the multi-phase inverter comprises a plurality of high side switches and a plurality of low side switches; each of the plurality of low side switches comprises a first connection and a second connection; each of the plurality of high side switches are coupled to the first connection of a respective low side switch of the plurality of low side switches; each of the plurality of inverter terminals is coupled to the second connection of a respective low side switch of the plurality of low side switches; and each of the plurality of inverter terminals is and external connection of the power module package. ### Claim 11 (depends on 1) The power module package of claim 1, further comprising: a plurality of inverter connections coupled to the multi-phase inverter, the plurality of inverter connections being configured to provide overcurrent protection to the power module package, wherein each of the plurality of inverter connections is an external connection of the power module package. ### Claim 12 A power module package comprising: a multi-phase inverter; a power factor correction (PFC) circuit configured to regulate a bus voltage of said multi-phase inverter; a common driver integrated circuit (IC) configured to drive said multi-phase inverter and said PFC circuit, wherein said multi-phase inverter, said PFC circuit, and said common driver IC are disposed on a single substrate of said power module package, and wherein said PFC circuit comprises a diode connected antiparallel with a PFC switch; and a common fault terminal coupled to the common driver IC, the common fault terminal configured to generate one or more fault signals at the common fault terminal, indicate an overcurrent condition of said PFC circuit using the one or more fault signals, indicate an overcurrent condition of said multi-phase inverter using the one or more fault signals, and enable or disable switching of said PFC circuit and said multi-phase inverter by receiving one or more enable/disable signals, wherein the common fault terminal is an external terminal of the power module package. ### Claim 13 (depends on 12) The power module package of claim 12, comprising a PFC overcurrent protection circuit in said common driver IC, wherein the common driver IC and the PFC overcurrent protection circuit are disposed in the common driver IC. ### Claim 14 (depends on 12) The power module package of claim 12, comprising an inverter overcurrent protection circuit in said common driver IC, wherein the common driver IC and the inverter overcurrent protection circuit are disposed in the common driver IC. ### Claim 15 (depends on 12) The power module package of claim 12, comprising a common reset timing circuit that is configured to signal reset of overcurrent protection of said PFC circuit and said multi-phase inverter. ### Claim 16 (depends on 12) The power module package of claim 12, wherein the single substrate is a leadframe-based substrate. ### Claim 17 (depends on 12) The power module package of claim 12, wherein the single substrate is an insulated metal substrate (IMS). ### Claim 18 A power module package comprising: a three-phase inverter comprising U-phase, V-phase, and W-phase circuits; a power factor correction (PFC) circuit configured to regulate a bus voltage of said three-phase inverter; a common driver integrated circuit (IC) configured to drive said U-phase, V-phase, and W-phase circuits and said PFC circuit, wherein said three-phase inverter, said PFC circuit, and said common driver IC are disposed on a single substrate of said power module package, and wherein said PFC circuit comprises a diode connected antiparallel with a PFC switch; a first external input terminal internally coupled to both the PFC circuit and the three-phase inverter, the first external input terminal being configured to receive an external high side DC voltage; a second external input terminal internally coupled to the PFC circuit and configured to receive an external low side DC voltage; a third external input terminal internally coupled to the PFC circuit and configured to receive an external PFC input voltage, wherein the external PFC input voltage is a rectified version of an AC input voltage; and a plurality of external output terminals configured to output a multi-phase output, the plurality of external output terminals being coupled to the three-phase inverter. ### Claim 19 (depends on 18) The power module package of claim 18, wherein said common driver IC is configured to drive said PFC switch of said PFC circuit. ### Claim 20 (depends on 18) The power module package of claim 18, wherein said U-phase, V-phase, and W-phase circuits each respectively comprise a high side power switch and a low side power switch. ### Claim 21 (depends on 18) The power module package of claim 18, wherein said PFC circuit comprises a boost PFC.