# US 10,122,183 B2 · Thin film coil and electronic device having the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,183 B2 - Document ID: US10122183B2 - Status: Granted - Kind: B2 - Application number: 15/654,092 - Filed: 2017-07-19 - Published: 2017-11-02 - Granted: 2018-11-06 - Earliest claimed: 2012-03-29 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Dae Ki Lim; Tae Sung Kim; Hyeon Gil Nam; Chan Gwang An; Hyun Seok Lee; Ki Won Chang; Chang Mok Han; Sang Woo Bae; Sung Eun Cho; Jae Suk Sung - Web page: https://patentgrep.com/patent/US10122183B2 ## CPC - H01F 27/2804: {Printed windings} - H01F 5/00: Coils (superconducting coils H01F6/06; fixed inductances of the signal type H01F17/00) - H01F 27/29: Terminals; Tapping arrangements {for signal inductances} - H01F 38/14: Inductive couplings - H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop - H01Q 7/06: with core of ferromagnetic material (H01Q7/02 takes precedence) - H02J 50/10: using inductive coupling - H02J 50/70: involving the reduction of electric, magnetic or electromagnetic leakage fields - H01F 17/00: Fixed inductances of the signal type - H01F 17/0006: {Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K)} - H01F 2017/004: {with the coil helically wound around an axis without a core} - H01F 2017/0053: {with means to reduce eddy currents} - H01F 2017/0073: {with a special conductive pattern, e.g. flat spiral} - H01F 2017/0086: {on semiconductor substrate} - H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H02J: ELECTRIC POWER NETWORKS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY ## Abstract There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates. ## Claims ### Claim 1 A coil substrate provided in a wireless power transmitter, wirelessly transmitting power, or in a wireless power receiver, wirelessly receiving power, the coil substrate comprising: a substrate having a first surface and a second surface; a first spiral pattern disposed on the first surface of the substrate, and having a partially disconnected spiral shape; a second spiral pattern disposed on the second surface of the substrate, and having both ends electrically connected to the first spiral pattern; and a lead-out pattern having an end connected to the first spiral pattern, and disposed on the first surface of the substrate to traverse a disconnected portion of the first spiral pattern from an inside of the first spiral pattern to an outside of the first spiral pattern, wherein electrical connection of the first spiral pattern is maintained across the disconnected portion by a plurality of first vias that penetrate through the substrate to electrically connect to the second spiral pattern, wherein a portion of the coil substrate, outside of the disconnected portion, includes the first spiral pattern overlapping the second spiral pattern and electrically insulated therebetween by the substrate. ### Claim 2 (depends on 1) The coil substrate of claim 1, further comprising two first pads disposed on one surface of the first surface and the second surface of the substrate, wherein one of the first pads is electrically connected to the lead-out pattern, and the other first pad is electrically connected to an end of at least one of the first spiral pattern and the second spiral pattern. ### Claim 3 (depends on 2) The coil substrate of claim 2, further comprising: at least one second pad disposed on the other surface of the first surface and the second surface of the substrate; and a second via disposed between the first pad and the second pad to electrically connect the first and second pads to each other. ### Claim 4 (depends on 2) The coil substrate of claim 2, further comprising a magnetic member portion disposed on the first surface over the first spiral pattern or disposed on the second surface of the substrate over the second spiral pattern. ### Claim 5 (depends on 4) The coil substrate of claim 4, further comprising a metal sheet disposed on an external surface of the magnetic member portion. ### Claim 6 (depends on 4) The coil substrate of claim 4, wherein the substrate is configured to have a protrusion portion that is at least partially not covered by the magnetic member portion, and the first pads are disposed on the protrusion portion of the substrate. ### Claim 7 (depends on 1) The coil substrate of claim 1, further comprising a third via disposed in the substrate within an inner portion of the first spiral pattern, to electrically connect an end of the lead-out pattern to the second spiral pattern. ### Claim 8 (depends on 1) The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern are disposed on positions of two surfaces of the substrate, respectively, the positions corresponding to each other in a vertical direction. ### Claim 9 (depends on 1) The coil substrate of claim 1, wherein both ends of the first spiral pattern are connected to both ends of the second spiral pattern, respectively. ### Claim 10 (depends on 1) The coil substrate of claim 1, wherein the substrate is a circuit board. ### Claim 11 (depends on 10) The coil substrate of claim 10, wherein the circuit board is a flexible printed circuit board (FPCB), thin printed circuit board (PCB), or thin film circuit board. ### Claim 12 (depends on 1) The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern collectively form a coil pattern with an AC resistance characteristic related to AC resistance characteristics of parallel connected twisted wire strands. ### Claim 13 (depends on 1) The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern collectively form a coil pattern with a reduced skin effect. ### Claim 14 (depends on 1) The coil substrate of claim 1, wherein, in the lead-out pattern having the end connected to the first spiral pattern, the lead-out pattern has the end connected to an end of the first spiral pattern. ### Claim 15 (depends on 1) The coil substrate of claim 1, wherein the first spiral pattern and the second spiral pattern are respective thin film conductor patterns. ### Claim 16 (depends on 1) The coil substrate of claim 1, wherein the first spiral pattern is parallel to the second spiral pattern in the portion of the coil substrate outside of the disconnected portion.