# US 10,122,091 B2 · Microstrip patch antenna in cavity-backed structure including via-hole

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- Number: US 10,122,091 B2
- Document ID: US10122091B2
- Status: Granted
- Kind: B2
- Application number: 14/176,465
- Filed: 2014-02-10
- Published: 2015-05-21
- Granted: 2018-11-06
- Earliest claimed: 2013-11-20
- Assignees: Samsung Electronics Co., Ltd.; Korea Electronics Technology Institute
- Applicants: Samsung Electronics Co., Ltd.; Korea Electronics Technology Institute
- Inventors: Jae Sup Lee; Ho Jun Lee; Se Hwan Choi
- Web page: https://patentgrep.com/patent/US10122091B2

## CPC

- H01Q 9/0421: {with a shorting wall or a shorting pin at one end of the element (H01Q9/0414 takes precedence)}
- H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)

## Abstract

A microstrip patch antenna includes a via-hole pad including via-holes, a patch disposed on the via-hole pad, a feeding via-hole disposed at a side of the patch through the patch and the via-hole pad, and a shorting via-hole disposed at a side of the patch, and configured to connect the patch and a ground unit.

## Claims

### Claim 1

A microstrip patch antenna comprising:
a via-hole pad comprising a metal pattern defined at an outer boundary of the via-hole pad;
a patch disposed on the via-hole pad; and
a ground unit disposed below the via-hole pad at a first height from the patch, a substrate having a second height disposed between the patch and the ground unit,
wherein the first height is less than the second height,
wherein the metal pattern, the patch and the ground unit comprise via-holes that are aligned,
wherein the patch has a length less than a 1/7 of a wavelength in an operational frequency of the microstrip patch antenna using a shorting pin, and
wherein an energy field is concentrated between the patch and the ground unit in an edge of the microstrip patch antenna.

### Claim 2 (depends on 1)

The microstrip patch antenna of claim 1, further comprising:
a shorting via-hole disposed at a side of the patch through the patch and the via-hole pad to the ground unit, and configured to connect the patch and the ground unit.

### Claim 3 (depends on 1)

The microstrip patch antenna of claim 1, further comprising:
a feeding via-hole disposed at a side of the patch through the patch and the via-hole pad to a feed line, and configured to feed from the feed line to the patch.

### Claim 4 (depends on 1)

The microstrip patch antenna of claim 1, wherein the via-hole pad and the patch each has a substantially rectangular contour.

### Claim 5

A microstrip patch antenna comprising:
a via-hole pad corresponding to a cavity-backed structure, the via-hole pad comprising a metal pattern defined in an outer boundary of the via-hole pad;
a patch disposed on the via-hole pad;
a shorting via-hole configured to connect the patch and a ground unit;
a feeding via-hole configured to feed a feed unit to the patch, the feeding via-hole disposed at a side of the patch and penetrating through the patch and the via-hole pad to the feed unit,
wherein the ground unit is disposed at a first height from the patch, a substrate having a thickness defining a second height is disposed between the patch and the ground unit, and the first height is less than the second height,
wherein the metal pattern, the patch and the ground unit comprise via-holes that are aligned,
wherein the patch has a length less than a 1/7 of a wavelength in an operational frequency of the microstrip patch antenna using a shorting pin, and
wherein an energy field is concentrated between the patch and the ground unit in an edge of the microstrip patch antenna.

### Claim 6

A microstrip patch antenna, comprising:
a first layer comprising a patch;
a second layer comprising a via-hole pad and a metal pattern disposed at an outer boundary of the via-hole pad;
a third layer comprising a feed line and a ground unit, wherein the first layer, the second layer and the third layer are on different planes;
a feeding via-hole disposed at a side of the patch through the patch and the via-hole pad; and
a shorting via-hole disposed at a side of the patch, and configured to connect the patch and the ground unit,
wherein the second layer is disposed between the first layer and the third layer, and the feed line extends from a boundary of the microstrip patch antenna to connect with the patch,
wherein the metal pattern, the patch and the ground unit comprise via-holes that are aligned,
wherein the patch has a length less than a 1/7 of a wavelength in an operational frequency of the microstrip patch antenna using a shorting pin, and
wherein an energy field is concentrated between the patch and the ground unit in an edge of the microstrip patch antenna.

### Claim 7 (depends on 6)

The microstrip patch antenna of claim 6, wherein the feed line connects to the patch via the feeding via-hole.

### Claim 8 (depends on 6)

The microstrip patch antenna of claim 6, wherein the feed line extends from a boundary of the microstrip patch antenna proximate to the feeding via-hole.

### Claim 9 (depends on 6)

The microstrip patch antenna of claim 6, wherein the ground unit is disposed below the patch at a distance defining a first height that is equal to a second height defined by a thickness of a substrate on which the microstrip patch antenna is disposed.