# US 10,122,089 B2 · Magnetic nanocomposite materials and passive components formed therewith

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- Number: US 10,122,089 B2
- Document ID: US10122089B2
- Status: Granted
- Kind: B2
- Application number: 15/206,428
- Filed: 2016-07-11
- Published: 2016-11-03
- Granted: 2018-11-06
- Earliest claimed: 2013-03-29
- Assignees: Intel Corporation
- Applicants: Intel Corporation
- Inventors: Vijay K. Nair; Chuan Hu; Shawna M. Liff; Larry E. Mosley
- Web page: https://patentgrep.com/patent/US10122089B2

## CPC

- H01Q 7/06: with core of ferromagnetic material (H01Q7/02 takes precedence)
- G06F 1/16: Constructional details or arrangements
- H01F 1/0054: {Coated nanoparticles, e.g. nanoparticles coated with organic surfactant}
- H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}
- H01Q 1/2291: {used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W)}
- H01Q 23/00: Antennas with active circuits or circuit elements integrated within them or attached to them
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- H10W 70/09: extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
- H10W 72/0198: {batch processes}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 74/016: {using moulds}
- H10W 74/019: {using temporary auxiliary substrates (H10W74/017 takes precedence)}
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 74/473: {containing a filler}
- H10W 44/241: {for passive devices or passive elements}
- H10W 44/248: {for antennas}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/9413: {on encapsulations}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 74/40: characterised by their materials
- H10W 90/00: Package configurations
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H01F: MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method apparatus and material are described for radio frequency passives and antennas. In one example, an electronic component has a synthesized magnetic nanocomposite material with aligned magnetic domains, a conductor embedded within the nanocomposite material, and contact pads extending through the nanocomposite material to connect to the conductor.

## Claims

### Claim 1

An electronic component comprising:
a synthesized magnetic nanocomposite material with aligned magnetic domains, wherein the nanocomposite material comprises magnetic nanoparticles comprising a silica passivation layer coated with an aminosilane and a silane different from the aminosilane, wherein an amine endgroup of the aminosilane is covalently linked to an endgroup of the silane different from the aminosilane;
a conductor embedded within the nanocomposite material; and
contact pads extending through the nanocomposite material to connect to the conductor.

### Claim 2 (depends on 1)

The electronic component of claim 1, wherein the conductor is a copper strip, and wherein the contact pads are each at opposite ends of the strip to form an inductor.

### Claim 3 (depends on 2)

The electronic component of claim 2, wherein the copper strip is linear to form a single turn inductor.

### Claim 4 (depends on 1)

The electronic component of claim 1, further comprising a substrate to carry the nanocomposite material and the conductor and dielectric walls to isolate and contain the nanocomposite material.

### Claim 5 (depends on 1)

The electronic component of claim 1, wherein the silane that is different than the amnisilane is 3-glycidyloxypropyltrimethoxysilane.

### Claim 6 (depends on 1)

The electronic component of claim 1, wherein the aminosilane is N-aminoethyl-3-aminopropyltrimethoxy-silane.

### Claim 7 (depends on 6)

The electronic component of claim 6, wherein the silane that is different than the amnisilane is 3-glycidyloxypropyltrimethoxysilane.