# US 10,122,068 B2 · Wireless IC device, molded resin article, and method for manufacturing coil antenna > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,122,068 B2 - Document ID: US10122068B2 - Status: Granted - Kind: B2 - Application number: 15/337,270 - Filed: 2016-10-28 - Published: 2017-02-16 - Granted: 2018-11-06 - Earliest claimed: 2014-08-27 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Noboru Kato - Web page: https://patentgrep.com/patent/US10122068B2 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - G06K 19/077: Constructional details, e.g. mounting of circuits in the carrier - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A wireless IC device including a coil antenna includes a first substrate, a first metal post, a second metal post, and a connection conductor. First conductor patterns are provided on a first principal surface of the first substrate. The first metal post and the second metal post extend in a normal direction to the first principal surface of the first substrate, and first ends thereof are connected to the first-principal-surface-side conductor patterns. A first end of second conductor pattern is connected to a second end of the first metal post, and a second end of the connection conductor is connected to a second end of the second metal post. A second end of the first-principal-surface-side conductor patterns are power supply ends. ## Claims ### Claim 1 A wireless IC device comprising: a coil antenna; an RFIC element connected to the coil antenna; a printed wiring board including a first principal surface and a second principal surface; and a resin member adjacent to the first principal surface of the printed wiring board; wherein the coil antenna includes: a first conductor pattern provided on the printed wiring board; a first metal post that includes a first end and a second end and extends in a normal direction to the first principal surface of the printed wiring board, the first end being electrically connected to the first conductor pattern, the first metal post being embedded in the resin member; a second metal post that includes a first end and a second end and extends in the normal direction to the first principal surface of the printed wiring board, the first end being electrically connected to the first conductor pattern, the second metal post being embedded in the resin member; and a second conductor pattern provided on the resin member and including a first end that is electrically connected to the second end of the first metal post and a second end that is electrically connected to the second end of the second metal post; wherein the coil antenna has a winding axis that extends in a direction along the first principal surface of the printed wiring board; and the RFIC element is adjacent to the first principal surface of the printed wiring board, disposed between the first metal post and the second metal post, and embedded in the resin member. ### Claim 2 (depends on 1) The wireless IC device according to claim 1, further comprising a magnetic body disposed in the coil antenna. ### Claim 3 (depends on 1) The wireless IC device according to claim 1, wherein the first conductor pattern includes a first-principal-surface-side conductor pattern provided on the first principal surface of the printed wiring board, and a second-principal-surface-side conductor pattern provided on the second principal surface of the printed wiring board; and the RFIC element is mounted on the first principal surface of the printed wiring board, and is connected to a portion of the first-principal-surface-side conductor pattern. ### Claim 4 (depends on 3) The wireless IC device according to claim 3, wherein the first-principal-surface-side conductor pattern, the first metal post, and the second metal post are provided in a plurality; the second-principal-surface-side conductor pattern is connected in series to the first-principal-surface-side conductor patterns; the first-principal-surface-side conductor patterns and the second-principal-surface-side conductor pattern extend in an X-axis direction of an orthogonal X-Y-Z coordinate system; the first metal posts are arranged in a Y-axis direction of the orthogonal X-Y-Z coordinate system and extend in a Z-axis direction of the orthogonal X-Y-Z coordinate system; the second metal posts are arranged in the Y-axis direction of the orthogonal X-Y-Z coordinate system and extend in the Z-axis direction of the orthogonal X-Y-Z coordinate system; and the first metal posts, the second conductor pattern, the second metal posts, the first-principal-surface-side conductor patterns, and the second-principal-surface-side conductor pattern define a helical coil. ### Claim 5 (depends on 4) The wireless IC device according to claim 4, wherein the second-principal-surface-side conductor pattern is provided in a plurality; a number of the first-principal-surface-side conductor patterns, a number of the first metal posts, and a number of the second metal posts are each 3 or more, and a number of the second-principal-surface-side conductor patterns is 2 or more; and the first metal posts and the second metal posts are arranged in the Y-axis direction and disposed in a staggered pattern when viewed in the Z-axis direction. ### Claim 6 (depends on 5) The wireless IC device according to claim 5, wherein the helical coil includes a plurality of types of loops with different inner diameters, and two loops at opening surfaces of the helical coil are loops of one of the plurality of types of loops that has a largest inner diameter. ### Claim 7 (depends on 3) The wireless IC device according to claim 3, wherein a film thickness of the second-principal-surface-side conductor pattern is greater than a film thickness of the first-principal-surface-side conductor pattern. ### Claim 8 (depends on 1) The wireless IC device according to claim 1, further comprising a capacitor connected to the RFIC element. ### Claim 9 (depends on 1) The wireless IC device according to claim 1, wherein the RFIC element includes, in addition to an input-output terminal for a radio signal that is connected to the coil antenna, a digital signal terminal connected to an external digital circuit; and a terminal that is electrically connected to the digital signal terminal and connected to the external digital circuit is provided on the printed wiring board. ### Claim 10 A molded resin article in which a wireless IC device is embedded, wherein the wireless IC device includes: a coil antenna; an RFIC element connected to the coil antenna; a printed wiring board including a first principal surface and a second principal surface; and a resin member adjacent to the first principal surface of the printed wiring board; wherein the coil antenna includes: a first conductor pattern provided on the printed wiring board; a first metal post that includes a first end and a second end and extends in a normal direction to the first principal surface of the printed wiring board, the first end being electrically connected to the first conductor pattern, the first metal post being embedded in the resin member; a second metal post that includes a first end and a second end and extends in the normal direction to the first principal surface of the printed wiring board, the first end being electrically connected to the first conductor pattern, the second metal post being embedded in the resin member; and a second conductor pattern provided on the resin member and including a first end connected to the second end of the first metal post and a second end connected to the second end of the second metal post; wherein the coil antenna has a winding axis that extends in a direction along the first principal surface of the printed wiring board; and the RFIC element is adjacent to the first principal surface of the printed wiring board, disposed between the first metal post and the second metal post, and embedded in the resin member. ### Claim 11 (depends on 10) The molded resin article according to claim 10, wherein the wireless IC device further includes a magnetic body disposed in the coil antenna. ### Claim 12 (depends on 10) The molded resin article according to claim 10, wherein the first conductor pattern includes a first-principal-surface-side conductor pattern provided on the first principal surface of the printed wiring board, and a second-principal-surface-side conductor pattern provided on the second principal surface of the printed wiring board; and the RFIC element is mounted on the first principal surface of the printed wiring board, and is connected to a portion of the first-principal-surface-side conductor pattern. ### Claim 13 (depends on 12) The molded resin article according to claim 12, wherein the first-principal-surface-side conductor pattern, the first metal post, and the second metal post are provided in a plurality; the second-principal-surface-side conductor pattern is connected in series to the first-principal-surface-side conductor patterns; the first-principal-surface-side conductor patterns and the second-principal-surface-side conductor pattern extend in an X-axis direction of an orthogonal X-Y-Z coordinate system; the first metal posts are arranged in a Y-axis direction of the orthogonal X-Y-Z coordinate system and extend in a Z-axis direction of the orthogonal X-Y-Z coordinate system; the second metal posts are arranged in the Y-axis direction of the orthogonal X-Y-Z coordinate system and extend in the Z-axis direction of the orthogonal X-Y-Z coordinate system; and the first metal posts, the second conductor pattern, the second metal posts, the first-principal-surface-side conductor patterns, and the second-principal-surface-side conductor pattern define a helical coil. ### Claim 14 (depends on 13) The molded resin article according to claim 13, wherein the second-principal-surface-side conductor pattern is provided in a plurality; a number of the first-principal-surface-side conductor patterns, a number of the first metal posts, and a number of the second metal posts are each 3 or more, and a number of the second-principal-surface-side conductor patterns is 2 or more; and the first metal posts and the second metal posts are arranged in the Y-axis direction and disposed in a staggered pattern when viewed in the Z-axis direction. ### Claim 15 (depends on 14) The molded resin article according to claim 14, wherein the helical coil includes a plurality of types of loops with different inner diameters, and two loops at opening surfaces of the helical coil are loops of one of the plurality of types of loops that has a largest inner diameter. ### Claim 16 (depends on 10) The molded resin article according to claim 10, wherein a film thickness of the second-principal-surface-side conductor pattern is greater than a film thickness of the first-principal-surface-side conductor pattern. ### Claim 17 (depends on 10) The molded resin article according to claim 10, wherein the wireless IC device further includes a capacitor connected to the RFIC element. ### Claim 18 (depends on 10) The molded resin article according to claim 10, wherein the RFIC element includes, in addition to an input-output terminal for a radio signal that is connected to the coil antenna, a digital signal terminal connected to an external digital circuit; and a terminal that is electrically connected to the digital signal terminal and connected to the external digital circuit is provided on the printed wiring board.