# US 10,121,951 B2 · Light-emitting device substrate, light-emitting device, and method for producing light-emitting device substrate

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- Number: US 10,121,951 B2
- Document ID: US10121951B2
- Status: Granted
- Kind: B2
- Application number: 15/033,252
- Filed: 2014-11-12
- Published: 2016-08-25
- Granted: 2018-11-06
- Earliest claimed: 2013-11-29
- Assignees: Sharp Kabushiki Kaisha
- Applicants: Sharp Kabushiki Kaisha
- Inventors: Shin Itoh; Masahiro Konishi
- Web page: https://patentgrep.com/patent/US10121951B2

## CPC

- H10H 20/8581: {characterised by their material}
- H10H 20/84: Coatings, e.g. passivation layers or antireflective coatings
- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10P 14/6324: {Formation by anodic treatments, e.g. anodic oxidation}
- H10W 90/00: Package configurations
- H10H 20/032: {of electrodes}
- H10H 20/036: {of packages}
- H10H 20/0363: {of optical field-shaping means}
- H10H 20/0364: {of interconnections}
- H10H 20/0365: {of means for heat extraction or cooling}
- H10W 72/073: {of die-attach connectors}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

In a light-emitting device substrate (2), a light reflecting surface covered with an anodized aluminum layer (12) is formed on one side of a base (14), and a glass-based insulator layer (11) and electrode patterns (5⋅6) disposed on the first insulating layer (11) are formed on the one side of the base (14) in a region not covered with the anodized aluminum layer (12). A glass-based insulator layer (13) is formed at least on the other side of the base (14) that is opposite the one side of the base (14). Therefore, a light-emitting device substrate having high reflectivity, high heat dissipation capability, dielectric withstand capability, and long-term reliability and excellent in mass productivity can be realized.

## Claims

### Claim 1

A method for producing a light-emitting device including a plurality of light-emitting elements and a light-emitting device substrate including a base that includes aluminum, the method comprising:
(a) forming, as an integral portion of one side of the base, a light reflecting surface that is exposed to an outside atmosphere by subjecting the one side of the base to anodic oxidation, the light reflecting surface being an anodized aluminum coating;
(b) forming a first insulating layer on the one side of the base in a region other than the light reflecting surface;
(c) forming an electrode pattern on the first insulating layer; and
(d) forming a second insulating layer at least on the other side of the base that is opposite the one side of the base, wherein
the step (a) is performed after the step (b),
the plurality of light-emitting elements are on the anodized aluminum coating of the light-emitting device substrate,
a spacing between adjacent ones of the plurality of light-emitting elements is at least two times a thickness of the second insulating layer,
a thickness of the base is 10 mm or less and at least one-half the spacing,
the step (c) includes the sub-steps of:
(h) forming a conductive layer on the first insulating layer; and
(i) forming an electrode pattern on the conductive layer, and
the step (a) is performed between the sub-step (h) and the sub-step (i).