# US 10,121,947 B2 · Flexible LED assembly with UV protection > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,947 B2 - Document ID: US10121947B2 - Status: Granted - Kind: B2 - Application number: 15/316,028 - Filed: 2015-05-26 - Published: 2017-04-13 - Granted: 2018-11-06 - Earliest claimed: 2014-06-10 - Assignees: 3M Innovative Properties Company - Applicants: 3M Innovative Properties Company - Inventors: Ravi Palaniswamy; Alejandro Aldrin Il Agcaoili Narag; Siang Sin Foo; Hiromitsu Kosugi - Web page: https://patentgrep.com/patent/US10121947B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - B32B 7/12: using interposed adhesives or interposed materials with bonding properties - B32B 15/08: of synthetic resin - B32B 27/281: {comprising polyimides} - H05K 1/036: {Multilayers with layers of different types} - H10H 20/8506: {Containers} - H10H 20/855: Optical field-shaping means, e.g. lenses - B32B 2255/10: on synthetic resin layer or on natural or synthetic rubber layer - B32B 2255/20: Inorganic coating - B32B 2307/202: Conductive - B32B 2457/202: LCD, i.e. liquid crystal displays - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 1/0346: {containing N} - H05K 1/189: characterised by the use of flexible or folded printed circuits - H05K 3/28: Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} - H05K 2201/0154: Polyimide - H05K 2201/017: Glass ceramic coating, e.g. formed on inorganic substrate - H05K 2201/0179: Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor - H05K 2201/09827: Tapered, e.g. tapered hole, via or groove - H05K 2201/09881: Coating only between conductors, i.e. flush with the conductors - H05K 2201/10106: Light emitting diode [LED] - H10H 20/036: {of packages} - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described. ## Claims ### Claim 1 A flexible LED assembly comprising: a flexible polymer substrate; a first conductive feature positioned within and on a surface of the flexible substrate; a second conductive feature positioned within and on the surface of the flexible substrate at a distance from the first conductive feature, such that a portion of the flexible polymer substrate between the first and second conductive features is exposed; and a ceramic layer positioned on the exposed flexible polymer surface between the first and second conductive features. ### Claim 2 (depends on 1) The flexible LED assembly of claim 1, further comprising an LED mounted on both the first and second conductive features, wherein the flexible polymer substrate is shielded from UV light emitted from the LED by the ceramic layer. ### Claim 3 (depends on 1) The flexible LED assembly of claim 1, wherein the flexible polymer substrate comprises polyimide. ### Claim 4 (depends on 1) The flexible LED assembly of claim 1, wherein the ceramic layer comprises Al2O3, AlN, or BN. ### Claim 5 (depends on 2) The flexible LED assembly of claim 2, wherein the LED comprises a flip chip solder bonded to the first and second conductive features. ### Claim 6 (depends on 2) The flexible LED assembly of claim 2, wherein the LED is eutectic bonded to the first and second conductive features. ### Claim 7 (depends on 1) The flexible LED assembly of claim 1, further comprising an LED that is mounted on the first conductive feature but not the second conductive feature, wherein the flexible polymer substrate is shielded from UV light emitted from the LED by the ceramic layer. ### Claim 8 (depends on 7) The flexible LED assembly of claim 7, wherein the LED is attached to the first conductive feature using epoxy binding adhesive, conductive paste, anisotropic conductive paste (ACP), anisotropic conductive film (ACF) or eutectic bonding. ### Claim 9 A flexible LED assembly comprising: a flexible polymer substrate comprising a via extending therethrough; a first conductive feature positioned on a bottom surface of the flexible substrate, a portion of the first conductive feature being positioned beneath the via; and a ceramic layer positioned on a top surface of the flexible polymer substrate. ### Claim 10 (depends on 9) The flexible LED assembly of claim 9, further comprising a second via in the flexible polymer substrate, and a second conductive feature positioned on a bottom surface of the flexible substrate, a portion of the second conductive feature being positioned beneath the second via. ### Claim 11 (depends on 9) The flexible LED assembly of claim 9, wherein the ceramic layer comprises a planar first portion and a planar second portion, the first portion disposed on the top surface of the flexible polymer substrate, the second portion extending from an end of the first portion, the first and second portions being noncoplanar. ### Claim 12 (depends on 11) The flexible LED assembly of claim 11, wherein the first and second portions define an oblique angle therebetween. ### Claim 13 (depends on 9) The flexible LED assembly of claim 9, wherein the ceramic layer is an aluminum nitride layer. ### Claim 14 (depends on 1) The flexible LED assembly of claim 1, wherein the ceramic layer comprises a planar first portion and a planar second portion, the first portion disposed on the exposed flexible polymer surface, the second portion extending from an end of the first portion, the first and second portions being noncoplanar. ### Claim 15 (depends on 14) The flexible LED assembly of claim 14, wherein the second portion extends in a direction away from the flexible substrate and conforms to a side of one of the first and second conductive features. ### Claim 16 (depends on 1) The flexible LED assembly of claim 1, further comprising an LED mounted on both the first and second conductive features, the LED comprising a lateral die. ### Claim 17 (depends on 1) The flexible LED assembly of claim 1, further comprising a wire bonded LED mounted on both the first and second conductive features. ### Claim 18 (depends on 1) The flexible LED assembly of claim 1, wherein the ceramic layer is an aluminum nitride layer.