# US 10,121,944 B2 · Method for producing optical semiconductor device and optical semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,944 B2 - Document ID: US10121944B2 - Status: Granted - Kind: B2 - Application number: 15/846,077 - Filed: 2017-12-18 - Published: 2018-04-19 - Granted: 2018-11-06 - Earliest claimed: 2015-10-13 - Assignees: Rohm Co., Ltd. - Applicants: Rohm Co., Ltd. - Inventors: Masahiko Kobayakawa - Web page: https://patentgrep.com/patent/US10121944B2 ## CPC - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/01: Manufacture or treatment - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/036: {of packages} - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10W 72/0198: {batch processes} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A method is provided for making optical semiconductor devices collectively. LED chips are arranged on a material substrate, and the substrate is sandwiched by a common mold and a first cooperating mold formed with a cavity. A light-transmitting resin is injected into the cavity and solidified to form a light-transmitting resin member including body portions for sealing the LED chips and connecting portions each connecting adjacent body portions. Then, the substrate is sandwiched by the common mold and a second cooperating mold formed with another cavity. A light-shielding resin is injected into the cavity and solidified to form a light-shielding resin member filling the gaps between the body portions. The body portions are separated from each other by making cuts in the material substrate and the light-shielding resin member. ## Claims ### Claim 1 A device comprising: a base including a base obverse surface and a base reverse surface spaced apart from each other in a thickness direction of the base; an LED chip disposed on the base obverse surface; a light-transmitting resin member covering the LED chip; and a light-shielding resin member covering the light-transmitting resin member, wherein the light-transmitting resin member including a first portion disposed between the base and the light-shielding resin member, the first portion of the light-transmitting resin member overlapping both of the base and the light-shielding member as viewed in the thickness direction, and the first portion of the light-transmitting resin member includes an end surface exposed to an outer space of the device. ### Claim 2 (depends on 1) The device of claim 1, wherein each of the light-shielding member and the base includes an end surface flush with the end surface of the first portion of the light-transmitting resin member. ### Claim 3 (depends on 1) The device of claim 1, further comprising a resist layer disposed on the base obverse surface, the resist layer being disposed between the base and the light-shielding member. ### Claim 4 (depends on 3) The device of claim 3, wherein the resist layer surrounds the LED chip as viewed in the thickness direction. ### Claim 5 (depends on 3) The device of claim 3, wherein the light-shielding resin member includes a through portion accommodating the first portion of the light-transmitting resin member and extending in a first direction perpendicular to the thickness direction, and the resist layer includes a portion overlapping the through portion as viewed in the thickness direction, and the portion of the resist layer is smaller in dimension in the first direction than the through portion. ### Claim 6 (depends on 3) The device of claim 3, wherein the light-shielding member includes an inner surface surrounding the LED chip as viewed in the thickness direction, and the resist layer includes at least one part disposed in an area surrounded by the inner surface of the light-shielding member as viewed in the thickness direction. ### Claim 7 (depends on 6) The device of claim 6, wherein the at least one part of the resist layer includes two parts of the resist layer that are each disposed in the area surrounded by the inner surface of the light-shielding member as viewed in the thickness direction, and the LED chip is disposed between the two parts of the resist layer as viewed in the thickness direction. ### Claim 8 (depends on 3) The device of claim 3, wherein the resist layer includes an end surface flush with the end surface of the first portion of the light-transmitting resin member. ### Claim 9 (depends on 1) The device of claim 1, wherein the light-transmitting resin member includes a second portion disposed between the base and the light-shielding resin member, the second portion of the light-transmitting resin member overlapping both of the base and the light-shielding member as viewed in the thickness direction, the second portion of the light-transmitting resin member includes an end surface exposed to the outer space of the device, and the LED chip is disposed between the first and second portions of the light-transmitting resin member. ### Claim 10 (depends on 9) The device of claim 9, further comprising a resist layer disposed on the base obverse surface, the resist layer overlapping the first and second portions of the light-transmitting resin member as viewed in the thickness direction.