# US 10,121,942 B2 · Package including resin molded body having black resin part and light reflective foam part, and method for manufacturing package, light emitting device, and method for manufacturing light emitting device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 10,121,942 B2
- Document ID: US10121942B2
- Status: Granted
- Kind: B2
- Application number: 15/785,945
- Filed: 2017-10-17
- Published: 2018-05-31
- Granted: 2018-11-06
- Earliest claimed: 2016-11-30
- Assignees: Nichia Corporation
- Applicants: Nichia Corporation
- Inventors: Motokiyo Shirahama
- Web page: https://patentgrep.com/patent/US10121942B2

## CPC

- H10H 20/852: Encapsulations
- B29C 45/03: Injection moulding apparatus (transfer moulding B29C45/02)
- B29C 45/16: Making multilayered or multicoloured articles {(B29C45/0062 takes precedence; feeding colouring materials into the injection unit B29C45/1816)}
- H10H 20/851: Wavelength conversion means
- H10H 20/856: Reflecting means
- H10W 74/01: Manufacture or treatment
- H10H 20/8506: {Containers}
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A package includes an element placement region, a pair of leads and a resin molded body. The resin molded body holds the pair of leads. The resin molded body includes a black resin part, and a light reflective foam part arranged at least on a part of a surface of the black resin part in a light irradiation region configured to be irradiated by light from a light emitting element placed in the element placement region.

## Claims

### Claim 1

A package comprising:
an element placement region;
a pair of leads; and
a resin molded body holding the pair of leads, the resin molded body including
a black resin part, and
a light reflective foam part arranged at least on a part of a surface of the black resin part in a light irradiation region configured to be irradiated by light from a light emitting element placed in the element placement region.

### Claim 2 (depends on 1)

The package according to claim 1, wherein
the black resin part defines a part of a recess, and
the light reflective foam part is arranged on at least one of a side surface and a bottom surface of the recess.

### Claim 3 (depends on 1)

A light emitting device comprising:
the package according to claim 1; and
a light emitting element placed in the element placement region.

### Claim 4

A method for manufacturing a package comprising:
providing a lead frame including packages, each of the packages including
an element placement region,
a pair of leads constituted by the lead frame, and
a resin molded body holding the pair of leads, the resin molded body including a black resin part; and
forming a light reflective foam part by foaming a portion of the black resin part arranged in a light irradiation region configured to be irradiated by a light emitting element placed on the element placement region.

### Claim 5 (depends on 4)

The method for manufacturing a package according to claim 4, wherein
the forming of the light reflective foam part includes irradiating laser light to the portion of the black resin part.

### Claim 6

A method for manufacturing a light emitting device comprising:
providing a package including a pair of leads and a resin molded body holding the pair of leads, the package including an element placement region and a light irradiation region configured to be irradiated by light from a light emitting element placed in the element placement region, a light reflective foam part being arranged in the light irradiation region; and
placing the light emitting element in the element placement region.