# US 10,121,930 B2 · Light receiving and emitting element module and sensor device using same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 10,121,930 B2 - Document ID: US10121930B2 - Status: Granted - Kind: B2 - Application number: 15/457,933 - Filed: 2017-03-13 - Published: 2017-08-24 - Granted: 2018-11-06 - Earliest claimed: 2012-04-25 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Hiroyuki Okushiba - Web page: https://patentgrep.com/patent/US10121930B2 ## CPC - H10F 55/255: formed in, or on, a common substrate - G01S 7/4813: {Housing arrangements} - G01S 17/04: Systems determining the presence of a target - G01V 8/10: Detecting, e.g. by using light barriers (by reflection from the object G01S17/00) - H03K 17/941: {using an optical detector (H03K17/968 takes precedence)} - H10F 55/25: wherein the radiation-sensitive devices and the electric light source are all semiconductor devices - H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80) - H03K 2217/94108: making use of reflection - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES - G01V: GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS (means for indicating the location of accidentally buried, e.g. snow-buried, persons A63B29/02) - H03K: PULSE TECHNIQUE (measuring pulse characteristics G01R; modulating sinusoidal oscillations with pulses H03C; transmission of digital information H04L; discriminator circuits detecting phase difference between two signals by counting or integrating cycles of oscillation H03D3/04; automatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses where the type of generator is irrelevant or unspecified H03L; coding, decoding or code conversion, in general H03M) ## Abstract A light receiving and emitting element module includes a substrate; a light emitting element and a light receiving element on an upper surface of the substrate; a frame-shaped outer wall that on the upper surface of the substrate; and a light shielding wall that is positioned inside the outer wall and partitions an internal space of the outer wall into spaces respectively corresponding to the light emitting element and the light receiving element. The light shielding wall includes a light emitting element-side shading surface on the light emitting element side, a light receiving element-side shading surface on the light receiving element side, and a lower surface that is connected to each of the light emitting element-side shading surface and the light receiving element-side shading surface, and that faces the substrate. The lower surface has an inclined surface inclined with respect to the upper surface of the substrate. ## Claims ### Claim 1 A light receiving and emitting element module, comprising: a semiconductor substrate having one conductivity-type; a light receiving element comprising a reverse conductivity-type semiconductor area which is positioned in an upper surface of the semiconductor substrate; a light emitting element comprising a plurality of semiconductor layers, the light emitting element being disposed on the upper surface of the semiconductor substrate; a light shielding wall which is positioned in an area between the light receiving element and the light emitting element and which comprises a lower surface being apart from the semiconductor substrate; a substrate on an upper surface of which the semiconductor substrate is disposed; and an outer wall which is disposed on the upper surface of the substrate and encloses the semiconductor substrate. ### Claim 2 (depends on 1) The light receiving and emitting element module according to claim 1, wherein an inner surface of the outer wall is apart from a side surface of the semiconductor substrate. ### Claim 3 (depends on 1) The light receiving and emitting element module according to claim 1, further comprising an upper wall which is disposed on an upper end of the outer wall and comprises a first through hole corresponding to the light emitting element and a second through hole corresponding to the light receiving element, wherein the light shielding wall is positioned between the first through hole and the second through hole and is disposed on a lower surface of the upper wall. ### Claim 4 (depends on 3) The light receiving and emitting element module according to claim 3, wherein a distance between the first through hole and the second through hole is larger than a width of the light shielding wall, and the light shielding wall is disposed apart from respective edges of the first through hole and the second through hole, the light receiving and emitting element module includes an inner space of the outer wall, and the lower surface of the upper wall between the first through hole and the second through hole is exposed to the inner space. ### Claim 5 (depends on 1) The light receiving and emitting element module according to claim 1, wherein a light emitting unit of the light emitting element is positioned closer to the light shielding wall than the outer wall. ### Claim 6 (depends on 1) A sensor device using the light receiving and emitting element module according to claim 1, wherein the sensor device irradiates an irradiation object with light from the light emitting element, and detects information of the irradiation object in accordance with electric current output from the light receiving element in response to reflected light from the irradiation object.